Technical Manager-Thermal-AI Datacenters

We're looking for a Technical Manager-Thermal-AI Datacenters to serve as the primary technical partner for customers as they evaluate and adopt high-performance thermal interface material (TIM) products. You will be responsible for leading early to mid-stage customer interactions, capturing and translating requirements into actionable technical work, and ensuring that customers have the support they need to successfully integrate and qualify TIM in their advanced semiconductor packaging applications.

RESPONSIBILITIES:

• Lead internal design and development efforts to integrate our liquid-metal based thermal interface materials into customer-specific electronic packages. 
• Build and test package and provision assembly mockups to demonstrate design feasibility, which may include mechanical and reliability testing. 
• Document designs for both fabrication and customer coordination. Lead effort to fabricate provisions either internally or externally in support of customer schedules. 
• Support R&D team in continuous improvement of system performance. 
• Act as the primary technical point of contact for ODM, OSAT, and hyperscaler customer technical teams during early and mid-stage engagement. 
• Work closely with business development team to uncover and document customer technical requirements, including geometric, load, assembly, environmental constraints, thermal budgets, and reliability standards. 
• Prepare and deliver technical content such as application notes, design guides, and data reports to support customer decision-making and qualification processes. 
• Support customer testing trials, troubleshooting technical issues in real time and coordinating resolution with internal engineering, manufacturing, and quality teams. 
• Capture customer feedback and synthesize insights to guide internal product development and roadmap planning.

DESIRED BACKGROUND:

• Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field. 
• CAD modeling and drafting, hands-on experience prototyping, mechanical and thermal testing, data analysis, and report generation. 
• 3–7 years of experience in semiconductor packaging, electronics assembly, thermal interface materials, or applications engineering in a B2B technical product company. 
• Strong understanding of system-level processor packaging/thermal design (cold plate and stiffener/lid design, TIM1/TIM1.5/TIM2 selection) and associated reliability testing (uHAST, TCT, HTS, etc.). 
• Proven ability to lead cross-functional technical efforts and deliver customer-specific solutions on time. 
• Excellent communication skills, with the ability to explain complex technical topics to both engineers and non-technical stakeholders. 
• Experience with design and fabrication of elastomeric materials is a plus. 
• Familiarity with tools such as thermal test setups, C-SAM, X-ray, or FEA modeling is a plus.