ASIC (Application Specific Integrated Circuit), Artificial Intelligence (AI), Communication Skills, Cross-Functional, Customer Relations, Ecosystems, Electrical Engineering, Leadership, Marketing Requirements Document (MRD), Marketing/Sales Collateral, Network Operations Center, OEM (Original Equipment Manufacturer), Optics, Printed Circuit Board Design, Product Management, Product Planning, Product Requirements Document (PRD), Product Strategy, Product Support, Product/Service Launch, Radio Frequency, Requirements Management, Requirements Validation/Verification, Signal Integrity, System Architecture, System Integration (SI), Technical Leadership, Technical Support, Technical/Engineering Design
Overview
Own the roadmap and product definition for next-generation copper, optical, and RF interconnect solutions used in AI and hyperscale data centers. Combine system-level technical depth with customer-facing product leadership.
Responsibilities
Define product strategy and requirements for high-speed interconnects (copper, optical, RF).
Translate customer needs into MRDs/PRDs and drive cross-functional execution.
Work with system architects, ASIC/xPU teams, board designers, and SI engineers.
Support technologies including co-packaged optics, near-packaged optics/copper, and advanced interconnect architectures.
Engage with hyperscalers, OEMs, and ecosystem partners to validate roadmaps and requirements.
Develop technical collateral and support product launches.
Qualifications
- MS in Electrical Engineering or related field.
- 5-7 years in system design, cable/interconnect design, or technical product management.
- Strong understanding of signal integrity, high-speed channels, and data-center system architectures.
- Experience working with technical and commercial customer teams.
- Excellent communication and cross-functional leadership skills.
Location(s)
Silicon Valley, CA (San Jose metro area)
Irvine, CA (Orange County area)