Technical Program Manager III

Location: Sunnyvale, CA — Onsite
Duration: 12 months, with possible extension/conversion
Pay Rate: $90/hour on W2
Benefits: Medical, Dental, Vision, 401k, PTO & Sick Leave

About the Role

We are seeking a Technical Program Manager III to support the development of next-generation AR wearable devices for a leading technology company. This role sits at the intersection of electrical hardware engineering, PCB development, supplier management, and cross-functional program execution.

The ideal candidate will have strong experience managing electrical components, flexible circuits (flexes), and multi-layer boards (MLBs) from early design through production. You will work closely with Electrical Engineers, cross-functional partners, and contract manufacturers to drive design releases, build execution, supplier readiness, quality, and overall program schedules.

This is a highly collaborative, hands-on role supporting innovative wearable products in a fast-paced environment. 

• Responsible for electrical parts and components in big tech, with a focus on AR wearables and small electrical components.
• Work outside standard hours to accommodate collaboration with APAC vendors.
• End-to-end ownership of PCB fabrication, including schematics, layouts, and form development through to execution and vendor approval for part fabrication.
• Experience in wearables, especially AR wearables and small electrical components.

• Direct ownership of design releases for flexes and MLBs (multi-layer boards) from early design through production.
• Collaborate with electrical engineers and cross-functional teams to develop flexible circuits and rigid circuit boards.
• Gather feedback, track schedules, and highlight risks throughout the development process.
• Manage SMT (Surface Mount Technology) and FATP (Final Assembly, Test, and Pack) builds end-to-end, optimizing for schedule, quality, and yield.
• Engage directly with APAC contract manufacturers, ensuring supplier readiness and managing flex vendor relationships.

• Minimum 5 years in electrical design, PCB development, or related hardware engineering roles.
• Direct ownership of design releases for flexes and MLBs (multi-layer boards) from early design through production.
• Managing SMT and FATP builds end-to-end, including schedule, quality, and yield optimization.
• Hands-on APAC CM (Contract Manufacturer) management, including flex vendor engagement and supplier readiness.

• Experience with AR wearable device development.
• Familiarity with small electrical component integration in compact form factors.
• Knowledge of advanced PCB fabrication techniques and materials.
• Experience in wearables or consumer electronics preferred.
• Degree in Electrical Engineering or related field preferred but not required. (Relevant experience is more important than formal education.)