onsemi is seeking a highly motivated engineer to work in our Technology Development group as a Process Integrator on Image Sensor technologies. This will include driving continuous improvement on new processes, new pixel architecture and technologies, Yield and Performance improvements, and New Product/Technology Introduction and ramp to volume manufacturing.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
Required Qualifications:
- Education: BS in Engineering or Materials Science
- Experience: 2-4 years or more of relevant experience in semiconductor manufacturing integration and technology development.
- Familiar with 5S, 8D, 6-sigma, SPC, DOE, FMEA
- Language Fluency - Fluent in English Language, written & verbal
Salary: onsemi is excited to share the base salary range for this position is $127,800 to $217,200 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf
Essential Responsibilities:
- Support new product development from the development phase through manufacturing, including full documentation to support ONSEMI's process change review.
- Ability to work well within a global matrixed team and able to drive projects and results independently.
- Ability to communicate effectively with all levels of the organization, including executive staff.
- Ability to operate independently and account for high-level objectives in detailed execution plans.
- A team player with strong listening skills who can take input and make informed decisions.
- Demonstrated understanding of Semiconductor technology, manufacturing, new product development, device, and Yield improvement.
- Ability to use Probe, In-line test, and Failure analysis data to champion and follow through with process changes.
- Proven experience and a deep knowledge and understanding of Image Sensor technology, as well as Pixel architecture and device performance, are highly preferred.
- Broad, cross-functional experience in semiconductor development and manufacturing is preferred, with specialization in Image Sensors highly desirable.
- Particular skills in BEOL Cu integration, Hybrid Bond, optical film stack deposition, and Back Side Illumination integration.
- Proficiency in SW tools such as MS Excel, PowerPoint, Word, MS Project, and Yield analysis tools such as Shiny, Excensio, JMP, etc.
- Drive cost reduction through yield enhancement and process simplification
Essential Responsibilities:
- Support new product development from the development phase through manufacturing, including full documentation to support ONSEMI's process change review.
- Ability to work well within a global matrixed team and able to drive projects and results independently.
- Ability to communicate effectively with all levels of the organization, including executive staff.
- Ability to operate independently and account for high-level objectives in detailed execution plans.
- A team player with strong listening skills who can take input and make informed decisions.
- Demonstrated understanding of Semiconductor technology, manufacturing, new product development, device, and Yield improvement.
- Ability to use Probe, In-line test, and Failure analysis data to champion and follow through with process changes.
- Proven experience and a deep knowledge and understanding of Image Sensor technology, as well as Pixel architecture and device performance, are highly preferred.
- Broad, cross-functional experience in semiconductor development and manufacturing is preferred, with specialization in Image Sensors highly desirable.
- Particular skills in BEOL Cu integration, Hybrid Bond, optical film stack deposition, and Back Side Illumination integration.
- Proficiency in SW tools such as MS Excel, PowerPoint, Word, MS Project, and Yield analysis tools such as Shiny, Excensio, JMP, etc.
- Drive cost reduction through yield enhancement and process simplification