Location: California
Reports To: Vice President, Systems Engineering
Salary Range: $150,000 – $170,000
We are seeking a highly skilled Thermal/Mechanical Engineer to join a leading engineering team in the development of innovative thermal solutions for memory and storage products. This role will play a critical part in shaping next-generation technologies that support AI, cloud computing, and enterprise infrastructure.
The Thermal/Mechanical Engineer will design, model, and validate advanced thermal solutions for high-performance memory and storage hardware used by top-tier OEMs, ODMs, and hyperscale clients. The ideal candidate will combine deep technical expertise with hands-on design and problem-solving skills.
Create mechanical and thermal models of electrical and mechanical assemblies using CAD files or from scratch.
Design or source thermal solutions for advanced memory and storage products.
Run simulations to validate that thermal designs meet specified requirements.
For custom solutions, specify required materials and prepare detailed fabrication and assembly drawings.
Develop and implement Design of Experiments (DoEs) to evaluate thermal properties of assemblies.
Collaborate with electrical engineering teams, providing feedback and design suggestions.
Generate assembly drawings and ensure proper documentation of assembly processes.
Partner with manufacturing to guarantee assemblies are built to specifications.
Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Engineering, or a related field.
8+ years of industry experience in IC packaging design, thermal, or mechanical engineering.
Proficiency in mechanical drawing tools such as AutoCAD and SolidWorks.
Experience with thermal analysis and simulation tools such as Flowtherm or Icepak.
Familiarity with thermal interface materials (heat sinks, spreaders, greases, gap pads, etc.) is desirable.
Strong problem-solving abilities, attention to detail, and ability to innovate.
Excellent communication skills, professionalism, and ability to work cross-functionally.
Proven stakeholder management and influencing skills.
Knowledge of memory and storage components (DDRx, LPDDRx, NAND) and modules (DIMMs, SSDs, etc.) is highly desirable.
Willingness to travel occasionally (less than 10%).
Work on cutting-edge thermal solutions powering the next generation of computing and storage.
Collaborate with world-class engineers in a fast-paced, innovative environment.
Competitive salary and growth potential.