Job Summary
Nokia's Photonic Integrated Circuit (PIC) wafer fabs in Sunnyvale and San Jose focus on the production and R&D of advanced Indium Phosphide (InP) semiconductor devices. As a Wafer Fab Integration Engineering Technician, you will play a critical role in supporting wafer fabrication processes, improving product quality, and reducing defects.
This position offers the opportunity to work closely with cross-functional engineering teams to troubleshoot complex process issues, enhance yield and reliability, and contribute to the ramp-up of a high-volume manufacturing facility in San Jose. You will be part of a collaborative environment that emphasizes teamwork, continuous learning, and cutting-edge semiconductor innovation.
Minimum Qualifications & Requirements
- Bachelor's degree in Science, Engineering, or a related technical field
- Minimum of 3 years of experience in a modern semiconductor fabrication environment (5+ years preferred)
- Strong attention to detail with a high commitment to quality
- Demonstrated problem-solving skills and ability to follow through on tasks
- Self-motivated, with a willingness to learn and expand technical skills
- Strong sense of ownership and accountability
- Effective team player with strong verbal and written communication skills
- Ability to manage multiple tasks, prioritize work, and meet deadlines
- Proficiency in using computer systems and software tools for data analysis and reporting
Preferred Qualifications:
- Experience with Indium Phosphide (InP) or Gallium Arsenide (GaAs) semiconductor processes
- Familiarity with wafer fab processes such as photolithography, etch, deposition, and CVD
Key Responsibilities
- Investigate root causes for production lots placed on hold and drive corrective actions
- Troubleshoot performance issues and yield excursions within the wafer fabrication process
- Support engineering tool qualifications and process validations
- Assist engineers with failure analysis, including:
o Visual inspections
o CD-SEM measurements
o Electrical IV testing
o Profilometry depth measurements
- Utilize Manufacturing Execution Systems (MES) to:
o Collect and track data
o Perform basic data analysis
o Generate reports (e.g., PowerPoint presentations)
- Monitor Statistical Process Control (SPC) charts and provide first-level response to out-of-control conditions
- Coordinate and track qualification and development lots across fabrication, assembly, and test operations
- Ensure compliance with PIC product quality systems and standards
- Support next-generation PIC platform development, including technology transfer and production ramp
- Collaborate with cross-functional teams to improve process integration, yield, and device performance
Work Schedule: Weekday day shift - Monday, Tuesday, Wednesday, and every other Thursday from 6:00 AM to 6:00 PM
Key Responsibilities
- Investigate root causes for production lots placed on hold and drive corrective actions
- Troubleshoot performance issues and yield excursions within the wafer fabrication process
- Support engineering tool qualifications and process validations
- Assist engineers with failure analysis, including:
o Visual inspections
o CD-SEM measurements
o Electrical IV testing
o Profilometry depth measurements
- Utilize Manufacturing Execution Systems (MES) to:
o Collect and track data
o Perform basic data analysis
o Generate reports (e.g., PowerPoint presentations)
- Monitor Statistical Process Control (SPC) charts and provide first-level response to out-of-control conditions
- Coordinate and track qualification and development lots across fabrication, assembly, and test operations
- Ensure compliance with PIC product quality systems and standards
- Support next-generation PIC platform development, including technology transfer and production ramp
- Collaborate with cross-functional teams to improve process integration, yield, and device performance
Work Schedule: Weekday day shift - Monday, Tuesday, Wednesday, and every other Thursday from 6:00 AM to 6:00 PM