Wireless Chip Architect

Position Overview

Ceva is at the forefront of the Smart Edge revolution, with innovative state-of-the-art Silicon and Software solutions that enable products to Connect, Sense and Infer. Our advanced wireless technologies, including Bluetooth, Wi-Fi, UWB, and Cellular IoT, are integrated into over a Billion devices annually. We are offering you a unique opportunity to shape and make a great impact on the roadmap of connected devices.

In this role, you will be at the intersection of cutting-edge wireless technology and direct customer engagement. As a Wireless Architect, you drive the definition of connectivity subsystem architectures for next-generation products including Wi-Fi, Bluetooth, and UWB with mixed analog/digital hardware. You will also serve as a key technical partner for our customers, leading technical pre-sales, co-develop joint solution offerings, and bring a creative, flexible mindset to solving complex real-world connectivity challenges. This requires both architectural depth and strong product engineering experience, from concept through productization.

Responsibilities

Drive full-system view of how the connectivity subsystem interacts within an SoC, including CPU/processor, memory, and peripheral interfaces

Definition of connectivity subsystem architecture specifications including :

• Feature-set definition and PPA (Power, Performance, Area) targets

• Definition of system low power modes and PMU requirements

• Definition of HW and SW interfaces of the connectivity sub-systems including: HW interfaces, state machines, operation sequences, etc.

• Analog and digital domains partitioning

Customer Facing and Technical Engagement

• Lead technical discussions with customers, presenting connectivity architecture options and value propositions

• Co-develop joint solution offerings with customers and partners, acting as technical advisor during system integration phases

Support Product Lifecycle and Productization

• Support post-tape-out testing, production validation, and productization of wireless connectivity solutions

• Lead or contribute to production-readiness activities including silicon characterization, yield analysis, and qualification testing

Cross-functional Leadership

• Work closely with logic design, physical design, firmware, and validation teams to ensure successful implementation

• Support wireless subsystem integration process from architectural definition through implementation, lab integration and test coverage planning

• Collaborate with product management and business development stakeholders to translate customer feedback into architectural requirements and product roadmap inputs
  

Qualifications

• B.Sc. or M.Sc in Electrical Engineering

• Deep understanding of full-system SoC architecture, with emphasis on how connectivity subsystems interact with processors, memory controllers, power domains, and software stacks

• Product engineering experience: deep understanding of full lifecycle including post tape-out testing, silicon bring-up, productization, and production qualification.

• Experience in system definition for wireless communication systems

• Experience in wireless communication standards (such as WiFi/BT/Cellular/UWB)

• Experience in ASIC design and architecture, with proven experience in successful tape-outs and production

• Knowledge in performance and power modeling and analysis

• Deep understanding of VLSI development process and methods

• Technical leadership

• Strong communicator, able to translate complex architectural concepts for customers, executives, and engineering teams.

• Creative and flexible mindset: comfortable navigating ambiguous requirements and proposing pragmatic, innovative solutions

• Proven customer facing experience. Leading technical discussion, building trust, and influencing design decisions.

• Knowledge in RF integration and performance optimization

• Previous experience with 3rd party IP integration

• Knowledge in CPU/Processor architecture