Utilize CAD, statistical analysis software, automation tools, and laboratory equipment to develop, qualify, and optimize advanced microcircuit assembling processes including epoxy dispensing, component placement, gold-gold thermosonic bonding (wire bonding, ball bonding, stud bumping, flip chip), soldering, silver sintering and related manufacturing technologies. Working across materials, mechanical, electrical, and manufacturing disciplines, you'll collaborate with cross-functional teams to bring innovative products from concept into production, helping shape technologies used across communications, aerospace and defense, automotive, semiconductor, and emerging markets.