Responsibilities: By working with the packaging engineering team, design and develop assembly process flow, and build subassemblies for QC sub-systems with electronics and silicon photonics chips on PCBAs for both cryogenic and room temperature vacuum systems; By working with cross-functional teams and suppliers, finalize design, and assembly process flow with DFM, DFQ, FMEA tools to meet design targets and requirements by the sub-system team; Deliver and verify equipment, tooling, and fixtures by suppliers with the support of the supply chain; complete process development, and buyoff with process capability analysis and report; Release design document, work instruction, and control plans in the systems with change controls; Train, audit, and release processes and controls to the operation team for volume assembly build; Manage in-house processes with the Operations team, and manage contractor manufacturing for external processes; and be responsible for process technical support. Familiar with key opto-mechanical packaging and assembly equipment, piece-part supplier base, and the quality system; Experience in design, analysis, and assembly of subsystems; build NPI pilot line, transfer process to operation, and support manufacturing; supplier and contract manufacturing management experience is a plus.