Kissimmee, FL30+ days ago
Evaluate the effect of process input variables such as device side topography, pre-grind warpage, grinding abrasive grit, bond type, dressing condition, dressing tape type, feed rate, downforce, coolant flow rate on final thickness, TTV, WIWNU, mechanical grinding stresses, chipping, delamination, microcracking, post-grind warpage, and die cracking. Assist with optimizing surface preparation variables, wafer cleanliness, flatness, pretreatment, etc., coating variables, spin curves, edge bead removal, film thickness range, cure variables, Bake Temperature, Time, and Bonding variables, Bond strength, debond yield, control wafer bow, particle adders residues, and electrical parameters.