Our focus includes fusion bonding, hybrid bonding, wafer-to-wafer (W2W) and chip-to-wafer (C2W) integration, wafer thinning, and TSV technologies, enabling advanced architecture such as bonded-CFET, VCT DRAM, and 3D-stacked memory and logic devices. Leveraging expertise in semiconductor processing, materials science, device integration, and equipment engineering, TTCA collaborates with customers, research institutions, and TEL's global R&D network to solve critical technology challenges.