Components on boards include ceramic capacitors, diodes, GaN FETs, ICs, inductors, transformers, resistors, JANTX/JAN-military components, and small component sizes such as 0402 and 1212. Equipment includes Europlacer pick-and-place machines, DEK Horizon 8 stencil screen printers, BTU six-zone reflow ovens, Koh Young 3D SPI, and Nordson 3D AOI.