Senior Associate, Mechanical Packaging Engineer L3Harris Technologies IncSenior Associate, Mechanical Packaging EngineerOrlando, FLSupport production, manufacturing, and integration activities through investigation and troubleshooting of engineering change requests (ECRs), build issues, and non-conformance concerns, while working with cross-functional teams to help identify solutions. Electro-mechanical equipment includes ruggedized enclosed electronic equipment, cables, printed wire boards (PWBs), circuit card assemblies (CCAs), mechanical components, and support equipment.
Advanced Packaging Interposer Integration Engineer SkyWater Technology FoundryAdvanced Packaging Interposer Integration EngineerKissimmee, FLGain / utilize knowledge of the capabilities and interdependencies of tool sets within the process flow to create recipes that utilize temporary and permanent bonding, electrolytic / PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflows, flip chip, wire bond tools. Utilize data analysis software to drive data driven decisionsCreate quick turn cycles of learning to identify issues early and create a final product and process flow for Foundry clients.
Advanced Packaging Bonding Engineer SkyWater Technology FoundryAdvanced Packaging Bonding EngineerKissimmee, FLRequired Qualifications:Education: 7-10 years experience with BS, 5-7 years experience with MS, 2+ years experience with PhDExperience and Skills: Hands‑on experience with fab processing tools in advanced packaging process area. Position Summary:We are looking for a hardworking, passionate, and experienced Advanced Packaging Laminate and Bonding Process Engineer for our Florida Advanced Packaging site.
Director of Advanced Packaging Process Engineering SkyWater Technology IncDirector of Advanced Packaging Process EngineeringKissimmee, FL$184,400–$276,600 / yearWe are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. In addition, they will closely collaborate with the Advanced Technology Services and Advanced Packaging Development Teams to create new manufacturing processes and capabilities, enabling the next generation of exciting new products to be manufactured at SkyWater.
Advanced Packaging Lamination & Bonding Engineer SkyWater Technology IncAdvanced Packaging Lamination & Bonding EngineerKissimmee, FL$114,320–$171,480 / yearWe are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market.
Advanced Packaging Interposer Integration Engineer SkyWater Technology IncAdvanced Packaging Interposer Integration EngineerKissimmee, FL$158,960–$238,440 / yearGain / utilize knowledge of the capabilities and interdependencies of tool sets within the process flow to create recipes that utilize temporary and permanent bonding, electrolytic / PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflows, flip chip, wire bond tools. We are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies.
Advanced Packaging Ball Attach Engineer SkyWater Technology FoundryAdvanced Packaging Ball Attach EngineerKissimmee, FLMajor Areas of Accountability: Provide technical leadership and management of Advanced Packaging Semiconductor processes in Support of Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding. The preferred candidate will have the ability to troubleshoot difficult and poorly defined problems in relation to the specific Process disciplines assigned using tool knowledge/experience, SPC, Qual data, and other available resources.
Advanced Packaging Process Development Engineer SkyWater Technology IncAdvanced Packaging Process Development EngineerKissimmee, FL$79,440–$119,160 / yearHighly desirable for a candidate to have a background in at least one of the following areas: Wafer Singulation, Solder Bumping, Maskless Photolithography, PVD and/or CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology, Probe/Test (some areas may be combined). Major Areas of Accountability: Provide technical leadership and management of Advanced Packaging Semiconductor processes in Support of Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding.
NewRobotic Packaging Pharmacy Technician SpecialtyRxRobotic Packaging Pharmacy TechnicianOrlando, FloridaAt Specialty Rx, Inc., our mission is to provide exceptional service guided by our CARE culture — C ommitment, A ccountability, R espect, and E xcellence. Maintain floor stock, including restocking and timely removal of expired medications.
Packaging Operator - Night Shift Amcor PlcPackaging Operator - Night ShiftOrlando, FLSUMMARY Performs repetitive production and packing operations to mass-procedure products such as preforms by performing the following duties. MATHEMATICAL SKILLS Ability to add, subtract, multiply, and divide in all units of measure, using whole numbers, common fractions, and decimals.
NewPackaging Engineering Intern QorvoPackaging Engineering InternApopka, FL$31–$42 / hourQorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Qorvo reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as external competitiveness and internal comparability.
DevOps Engineer Configuration Manager Siemens AGDevOps Engineer Configuration ManagerOrlando, FLDevOps Engineer / Configuration Manager Job ID 516488 Posted since 13-Aug-2026 Organization Siemens Healthineers Field of work Research & Development Company Siemens Healthcare Private Limited Experience level Experienced Professional Job type Full-time Work mode Office/Site only Employment type Permanent Any Siemens location in Karnataka - India Siemens Healthineers is a global leader in medical technology, working to improve patient care and healthcare outcomes. Job ID 516488 Posted since 13-Aug-2026 Organization Siemens Healthineers Field of work Research & Development Company Siemens Healthcare Private Limited Experience level Experienced Professional Job type Full-time Work mode Office/Site only Employment type Permanent Any Siemens location in Karnataka - India Siemens Healthineers is a global leader in medical technology, working to improve patient care and healthcare outcomes.