Director Of Advanced Packaging Process Engineering SkyWater Technology FoundryDirector Of Advanced Packaging Process EngineeringKissimmee, FLMinimum of 5 years of management experienceExperience with application of structured problem solving methodologyExperience with Design of ExperimentsExperience with automated fault detection and control systems (FDC)Positive interpersonal skills, highly energetic and self motivatedOutstanding communication skills - both written and verbalDemonstrated ability to meet commitments and deliver resultsAbility to manage and execute multiple projects simultaneously and shift priorities to meet business needsKnowledge of SPC is preferred. Experience and/or Training: Minimum of 10 years experience of semiconductor technology development, advanced packaging and/or process integration experienceExperience in Advanced Packaging preferredProven track record of driving advanced packaging technology and/or semiconductor wafer fab technology from R&D to HVM (high-volume manufacturing)Expert knowledge of semiconductor manufacturing processes(Litho, Etch, Deposition, CMP, etc) and/or advanced packaging technologies and formats (FOWLP, FCBGA, SiP, RDL, 3DIC, HBM).
Advanced Packaging Bonding Engineer SkyWater Technology FoundryAdvanced Packaging Bonding EngineerKissimmee, FLRequired Qualifications:Education: 7-10 years experience with BS, 5-7 years experience with MS, 2+ years experience with PhDExperience and Skills: Hands‑on experience with fab processing tools in advanced packaging process area. Position Summary:We are looking for a hardworking, passionate, and experienced Advanced Packaging Laminate and Bonding Process Engineer for our Florida Advanced Packaging site.
Advanced Packaging Interposer Integration Engineer SkyWater Technology FoundryAdvanced Packaging Interposer Integration EngineerKissimmee, FLGain / utilize knowledge of the capabilities and interdependencies of tool sets within the process flow to create recipes that utilize temporary and permanent bonding, electrolytic / PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflows, flip chip, wire bond tools. Utilize data analysis software to drive data driven decisionsCreate quick turn cycles of learning to identify issues early and create a final product and process flow for Foundry clients.
Advanced Packaging Ball Attach Engineer SkyWater Technology FoundryAdvanced Packaging Ball Attach EngineerKissimmee, FLMajor Areas of Accountability: Provide technical leadership and management of Advanced Packaging Semiconductor processes in Support of Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding. The preferred candidate will have the ability to troubleshoot difficult and poorly defined problems in relation to the specific Process disciplines assigned using tool knowledge/experience, SPC, Qual data, and other available resources.
Robotic Packaging Pharmacy Technician SpecialtyRxRobotic Packaging Pharmacy TechnicianOrlando, FloridaOur Company: SpecialtyRx is a Long-Term Care pharmacy providing pharmaceutical services to long term care facilities and assisted living communities. Maintain floor stock, including restocking and timely removal of expired medications.
Circuit Design Engineer Geologics CorporationCircuit Design EngineerOrlando, FLRole: Circuit Design Engineer Client: Defense-Aerospace Hourly Rate: up to $71/hr (W2, non-benefited) Length: 1-year contract Location: Orlando, FL - Hybrid Shift: 4x10, 1 st Shift Clearance: Due to the nature of work performed within our facilities, an Active Secret Clearance is required prior to start. Liaise with external silicon and PCB vendors, providing clear design files, bill of materials (BOM), and manufacturing instructions; support prototype fabrication, assembly, and yield analysis activities.