NewAdvanced Packaging SI/PI Engineer ETCHED LLCAdvanced Packaging SI/PI EngineerSan Jose, CAKey ResponsibilitiesSI/PI analysis of designs and optimization within 2D/2.5D/3D packagesClose interaction with Package Layout Designers, ASIC PD and IP teams as well as Board Schematic/Layout/SI/PI teams to optimize the best electrical performanceDrive SI requirements into interposer/substrate layout (high‑speed routing: 112G/224G) from preliminary design through tape‑out. BenefitsMedical, dental, and vision packages with generous premium coverage$500 per month credit for waiving medical benefitsHousing subsidy of $2k per month for those living within walking distance of the officeRelocation support for those moving to San Jose (Santana Row)Various wellness benefits covering fitness, mental health, and moreDaily lunch and dinner in our officeHow we're differentEtched believes in the Bitter Lesson.
Director, Advanced Packaging Disruptive Technology (Based in Singapore) Applied Materials IncDirector, Advanced Packaging Disruptive Technology (Based in Singapore)Santa Clara, CAThe Director will build and lead a high-impact team focused on exploratory, pre-product technologies, developing solutions such as D2W, RDL, CoWoS, TSV, etc and connecting emerging technology inflections to customer and market roadmaps. Based in Singapore, this role is responsible for defining and driving pathfinding strategy for N+2 and beyond advanced packaging technologies, leading disruptive innovation that shapes future integration architectures and unlocks new value creation opportunities.
Packaging Operator (Contractor) ReCor Medical IncPackaging Operator (Contractor)Palo Alto, CA$25–$30 / hourThis hourly role supports daily production by following written work instructions, performing in-process checks, and completing required production and packaging documentation accurately. Perform hands-on packaging and labeling of medical device components (e.g., catheters, connection cables) by cleaning components, pouching, and cartoning products per approved work instructions.
Advanced Packaging Reliability Engineer OpenAI LLCAdvanced Packaging Reliability EngineerSan Francisco, CAFor unincorporated Los Angeles County workers: we reasonably believe that criminal history may have a direct, adverse and negative relationship with the following job duties, potentially resulting in the withdrawal of a conditional offer of employment: protect computer hardware entrusted to you from theft, loss or damage; return all computer hardware in your possession (including the data contained therein) upon termination of employment or end of assignment; and maintain the confidentiality of proprietary, confidential, and non-public information. In-depth knowledge of advanced packaging architectures, including 2.5D and 3.5D integration, interposers, embedded bridges, chiplets, large package substrates, HBM integration, redistribution layers, and package-level power delivery.
Internship, Packaging Engineer, Supply Chain (Fall 2026) Tesla IncInternship, Packaging Engineer, Supply Chain (Fall 2026)Fremont, CA$16.35–$33.65 / hourConsider before submitting an application: This position is expected to start August 2026 or September 2026 and continue through the Fall term (ending approximately December 2026 or later, if available). Demonstrated ability to facilitate dynamic cross-functional projects with engineering, supply chain, manufacturing and test to meet project timelines.
Integrated Circuit Packaging Architect Advanced Micro Devices IncIntegrated Circuit Packaging ArchitectSan Jose, CASuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. The Role: Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
Senior IC Packaging Engineer Axiado CorpSenior IC Packaging EngineerSan Jose, CAAxiado has also won numerous industry awards for our ground-breaking products and technological innovations, including being named one of Fast Companys 2025 Top 10 Most Innovative Companies in Security, winning the 2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliances 2025 Start-Up to Watch award. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real-time platform management.
Packaging Structural Design Spec 3 RR Donnelley & Sons CoPackaging Structural Design Spec 3Santa Clara, CAMust have three (3) years of experience in/with: Client engagement and interfacing directly with clients and transforming ideas into shippable products and revenue; Identifying critical elements, variables, and alternatives to develop packaging design solutions; Structural design of packaging specifically for Precision Consumer Electronics packaging; Structural design experience in consumer product, educational, publishing, retail, consumer products, technology, or pharmaceutical markets; Handling packaging, manufacturing equipment, processes, and capabilities; and Working with packaging and prototyping equipment and processes; including. Manage whole design project including design creation, quick turn prototyping of various iterations of the design for review with the client, collaborating with global design and manufacturing team in Asia and India to ensure designs are manufacturable and can be automated easily, and conduct predictive product testing and analyze test data to predict design viability.
Integrated Circuit - Packaging Architect Engineer Advanced Micro Devices, IncIntegrated Circuit - Packaging Architect EngineerSan Jose, CaliforniaSuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. Responsibilities: The Role : Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
Director, Pricing and Packaging Strategy McAfee, LLCDirector, Pricing and Packaging StrategySan Jose, CaliforniaFull timeReporting to the Head of Pricing and partnering closely with executive leaders across Marketing, Retention, Product, and Retail, you’ll set the vision and frameworks that govern how we price, package, and promote across every channel and stage of the customer lifecycle – from acquisition through renewal – ensuring strategic coherence while maximizing long-term value. You’ll lead a high-impact pricing function, influence executive decisions on monetization strategy, and shape how millions of customers experience McAfee – from the first marketing touchpoint, through product packaging, into renewals and win-back, and across our retail ecosystem.
NewPackaging Engineer, R&D Cold Beverage Keurig Dr PepperPackaging Engineer, R&D Cold BeverageSan Francisco, CAExperience with CAD packaging software (SolidWorks, ArtiosCAD, Tops, CAPE).Experience with producing technical documents (specifications, detailed drawings, structural drawings)Experience managing projects with outside vendors and/or contract manufacturers a plus. Develop and refine specifications for KDP's packaging portfolio (PET Containers, cans, glass, closures, thermoformed containers, paperboard, corrugate, and flexibles).Validate, and lead execution of new materials for manufacturing scale-up.
Advanced Packaging Technologist Google LLCAdvanced Packaging TechnologistSunnyvale, CAFrom software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more. As an advanced packaging technologist, you will develop advanced packaging solutions (2.5D/3D/3.5D) for ML chips, which involves collaborating with architects, Signal Integrity (SI)/Power Integrity (PI), thermal, and Printed Circuit Board (PCB) engineers to create high-performance packages optimized for electrical performance, reliability, and assembly.
Sr. Creative Program Manager, eero Packaging Team Amazon.com IncSr. Creative Program Manager, eero Packaging TeamSan Francisco, CAIn addition to creating the packaging plan, which includes a global workback schedule for artwork development in various regions, the role requires management in the creation of technical publications, print on demand (POD) labels, and product labels under the guidance of legal, compliance, brand, marketing, and leadership. Drive cross-functional stakeholders including marketing, brand, product, legal, compliance, and operations to determine schedule for on-box packaging and label content for eero programs.
Senior Packaging Design Engineer, Silicon Google LLCSenior Packaging Design Engineer, SiliconMountain View, CA$163,000–$237,000 / yearCollaborate closely with Signal Integrity (SI), Power Integrity (PI), Test, New Product Introduction (NPI), and Mechanical Engineering teams to refine and optimize product package architecture and design. Skip navigation links home Home work_outline Jobs noogler_hat Students google How we work handyman How we hire person_outline Your career help_outline Help.
NewSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and Integration Macpower Digital Assets Edge Private LimitedSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and IntegrationSanta Clara, CA$64 / hourIf you enjoy solving complex challenges in mixed-signal design, chiplet integration, and high-performance electronics , this role is for you. We are looking for a Senior Electrical Engineer with deep expertise in semiconductor design, advanced packaging, and ASIC development .
Software Engineer 5 - Ads Pricing & Packaging Netflix IncSoftware Engineer 5 - Ads Pricing & PackagingLos Gatos, CA$388,000–$619,000 / yearThe Ads Pricing and Packaging team is responsible for developing cutting-edge inventory management systems which support various monetization strategies, including dynamic pricing, rate card management, product packaging, inventory segmentation, and yield optimization. Skills & experience we're seeking: Professional experience in building inventory management solutions that support monetization strategies such as dynamic pricing, rate card management, product packaging, inventory split and yield management.
Packaging Assembly Engineer Apple IncPackaging Assembly EngineerCupertino, CAIn this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC. Define and optimize end-to-end FCBGA assembly process flow (wafer back-end interface, flip-chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection).
Packaging Engineer Rodan & Fields LLCPackaging EngineerSan Ramon, CA$84,000–$105,000 / yearRodan + Fields Dermatologists is a direct selling skincare company founded in 2000 by Dr. Katie Rodan and Dr. Kathy Fields, world-renowned dermatologists, and creators of Proactiv Solution with a passion for giving people the best skin of their lives - and the confidence that comes with it. With effective products, a unique business model and a powerful community of Independent Consultants, Rodan + Fields has disrupted the skincare category to become a leading skincare brand in North America.
Packaging Product Design Engineering Manager Apple IncPackaging Product Design Engineering ManagerCupertino, CAApple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials. The Packaging PD team is a diverse group of people responsible for the design and execution of structural packaging for all Apple products - from shippers to finished goods boxes.
Packaging Product Design Engineer Apple IncPackaging Product Design EngineerCupertino, CAThe Packaging PD team is a diverse group of people responsible for the design and execution of structural packaging for all Apple products - from shippers to finished goods boxes. Apple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
Memory Packaging Engineer Apple IncMemory Packaging EngineerSanta Clara, CAMinimum requirement of a bachelors degree in a relevant fieldMS or PhD preferred, with 3+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages. If you are driven to solve the industrys toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.
Co-Packaged Optics Packaging Process Development Engineer Marvell Technology IncCo-Packaged Optics Packaging Process Development EngineerSanta Clara, CAWork with cross-functional packaging teams and lead process development at foundry along with 2.5D/3D CoW process development with particular emphasis on chemistry development with packaging consumable suppliers at OSATs to bring packaging solutions from concept to prototypes and ramp to high volume manufacturing with aggressive cost reduction strategies. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
Sr. Principal Engineer, Advanced Packaging Marvell Technology IncSr. Principal Engineer, Advanced PackagingSanta Clara, CAThe group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
Photonic Packaging Engineer, Principal Astera Labs IncPhotonic Packaging Engineer, PrincipalSan Jose, CA$205,000–$255,000 / yearAstera Labs' Intelligent Connectivity Platform integrates CXL, Ethernet, NVLink, PCIe, and UALink semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.
TEMP Packaging Designer Kendo BrandsTEMP Packaging DesignerSan Francisco, CAFull timeA dynamic engine of speed, expertise and market-savvy, the Kendo team continues to redefine the beauty industry through great product, great storytelling, great retail and direct-to-consumer partnerships. Kendo Holdings, Inc. is a San Francisco-based beauty brand developer and wholesaler owned by LVMH Moët Hennessy - Louis Vuitton, the world's largest luxury group.
Technologist, Packaging Engineering SanDisk CorpTechnologist, Packaging EngineeringMilpitas, CAProvide technical leadership in evaluating and validating design options through characterization builds and comprehensive DFX (Design for excellence) analyses, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), influencing product architecture and manufacturing strategy at the system level. ESSENTIAL DUTIES AND RESPONSIBILITIES: Serve as the senior Package Engineering representative on cross‑functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements.
Sr. Industrial Designer (Packaging) SanDisk CorpSr. Industrial Designer (Packaging)Milpitas, CAAn employee's pay position within the salary range may be based on several factors including but not limited to (1) relevant education; qualifications; certifications; and experience; (2) skills, ability, knowledge of the job; (3) performance, contribution and results; (4) geographic location; (5) shift; (6) internal and external equity; and (7) business and organizational needs. Sandisk is looking for a Senior Packaging Industrial Designer to join global industrial design team to design 3D structural packaging solutions for world‑class consumer storage products.
Packaging Sourcing Manager Kinder'sPackaging Sourcing ManagerWalnut Creek, CA$125,000–$145,000 / yearMost of our work happens in the office to spark creativity and community, but we also offer flexibility so team members have the autonomy to work outside the office when needed to support their work-life balance and personal commitments. By developing strong supplier partnerships, ensuring regulatory compliance, and driving process efficiencies, you will help Kinder's scale its impact while staying true to our values.
Advanced Packaging Engineer DensityAIAdvanced Packaging EngineerMountain View, CA$200,000–$350,000 / year10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies. Demonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions.
Cloud Hardware Development, Packaging, Network Product Development - Optics Amazon.com IncCloud Hardware Development, Packaging, Network Product Development - OpticsCupertino, CAYou will perform high-quality design, development, validation, and sustaining engineering of IC and SOC packages for high-speed applications, working closely with design teams, manufacturing partners, and cross-functional stakeholders to deliver robust solutions at scale. Within AWS Networking the NPD (Network Product Development) organization is responsible for, designing the hardware, building the software, and owning the interconnects for the routers that power the global AWS network.
NewInnovative Packaging Engineer - Cold Beverage R&D Keurig Dr PepperInnovative Packaging Engineer - Cold Beverage R&DSan Francisco, CACandidates should have a Bachelor's degree in Packaging Engineering and at least 4 years of experience with PET containers and testing packaging materials. A leading beverage company in San Francisco seeks a Packaging Engineer to develop and implement various packaging solutions.
Packaging Engineer Nexthop Systems IncPackaging EngineerSanta Clara, CAQualification plans to characterize and validate packaging solutions for product and it's FRU (Field replaceable unit), subassemblies or components as per industry or internal specifications by working closely with HW design (mechanical, thermal, electrical etc.) Come out with innovative ideas for cost optimization, durability during shipping, environmental impact, and compliance with safety regulations. In this role, you'll combine technical expertise with innovative problem-solving to plan & execute all qualifications activities for cutting-edge packaging designs, ensuring they meet the stringent demands of all global shipping environments.
NewCold Chain Packaging Engineer Integrated Resources, IncCold Chain Packaging EngineerFoster City, CA$88.89–$96.29 / hourThis position resides within the Packaging Development team at Client, with a primary focus on the development, qualification, and lifecycle management of controlled temperature (cold chain) packaging systems (thermal protection systems) to ensure product quality and regulatory compliance across global distribution of our pharmaceuticals and biologics products. Specific Education and Experience B.S. degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering, or a related scientific field.
Packaging Engineer Manpower EngineeringPackaging EngineerFremont, CATemporaryManpowerGroup® (NYSE: MAN), the leading global workforce solutions company, helps organizations transform in a fast-changing world of work by sourcing, assessing, developing, and managing the talent that enables them to win. We are recognized consistently for our diversity - as a best place to work for Women, Inclusion, Equality and Disability and in 2023 ManpowerGroup was named one of the World's Most Ethical Companies for the 14th year - all confirming our position as the brand of choice for in-demand talent.
Advanced Packaging Process Engineer Tenstorrent IncAdvanced Packaging Process EngineerSanta Clara, CAPartner with design, reliability, and architecture teams to evaluate tradeoffs (bump pitch, stack-ups, embedded Si, etc.) and lead test vehicle planning to meet program needs. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency.
Foundry Services Advanced Packaging Account Technical Solutions Engineer Intel CorpFoundry Services Advanced Packaging Account Technical Solutions EngineerSanta Clara, CA$220,320–$311,040 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
NewCoordinator, Packaging e.l.f. BeautyCoordinator, PackagingOakland, CaliforniaOur total compensation philosophy offers every full-time new hire competitive pay and benefits, bonus eligibility (200% of target over the last seven fiscal years), equity, flexible time off, year-round half-day Fridays, and a hybrid 3 day in office, 2 day at home work environment. You’ll own critical workflows from component assessments and supplier communications to PO execution and data integrity, ensuring every launch moves from idea to shelf with precision and speed.
NewSignal & Power Integrity Engineer for Chiplet Packaging EliyanSignal & Power Integrity Engineer for Chiplet PackagingSan Francisco, CAIdeal candidates have extensive experience in signal and power integrity, using advanced simulation tools, and are eager to contribute to high-performance manufacturable products.#J-18808-Ljbffr. This role involves developing innovative packaging solutions for chiplet interconnects while working with a talented cross-functional team.
NewLead IC Packaging Engineer - FCBGA & NPI Apple, Inc.Lead IC Packaging Engineer - FCBGA & NPISan Francisco, CAA leading technology firm in California is seeking an experienced IC Packaging Assembly Engineer to optimize flip-chip BGA assembly processes. Candidates must have over 10 years of experience in semiconductor packaging, a strong engineering background, and excellent problem-solving skills.
NewSenior Silicon Photonics Packaging Engineer Apple, Inc.Senior Silicon Photonics Packaging EngineerSan Francisco, CAApple Inc. is seeking a Silicon Photonics & Optical Packaging Engineer in San Francisco to develop next-generation optical interconnects. This role involves designing silicon photonic devices, collaborating with various teams, and developing packaging technologies.
NewIC Packaging Lead: Integration & Tech Innovation Apple, Inc.IC Packaging Lead: Integration & Tech InnovationSan Francisco, CAThis role involves working with cross-functional teams to develop innovative packaging solutions from concept to mass production. Generous compensation and benefits package offered, including stock options and educational reimbursements.#J-18808-Ljbffr.
NewSenior Packaging Designer & Engineer Hybrid SF (3-Month) HH GlobalSenior Packaging Designer & Engineer Hybrid SF (3-Month)San Francisco, CAThe ideal candidate has 6-8 years of experience in the creative packaging industry, proficiency in design software, and a strong understanding of packaging materials and processes. A leading health and tech brand in San Francisco is seeking a talented Packaging Designer for a full-time, hybrid role.
NewPackaging Engineer The Fountain Group LLCPackaging EngineerFoster City, CA$88.89–$96.30 / hourWe are seeking an experienced Cold Chain Packaging Engineer to develop, test, qualify, and support temperature-controlled (cold chain) packaging systems for the safe distribution of pharmaceutical and biologic products worldwide. What We're Looking For: Bachelor's degree in Packaging Engineering, Mechanical Engineering, Industrial Engineering, Biomedical Engineering, Chemical Engineering, or a related scientific field.
Lab Packaging Test Engineer I Engineer In Training (Swing Shift) Ryzen SolutionsLab Packaging Test Engineer I Engineer In Training (Swing Shift)San Jose, CA$66,560Perform testing duties within the designated workday hours according to requirements to ensure customer objectives are met through proactive communication, documentation, and customer service. Maintain responsive customer communication in email and in person regarding testing services provided, test status, updates, and results.
Sr Packaging Engineer Applied Materials IncSr Packaging EngineerSanta Clara, CA$133,500–$183,500 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.
IC Packaging Manager Blue Origin Enterprises LPIC Packaging ManagerCA$230,773–$323,081.85 / yearand/or transports placardable amounts of hazardous materials by ground in any vehicle on a public road while in commerce, may be subject to additional Federal Motor Carrier Safety Regulations including: Driver Qualification Files, Medical Certification (obtained before onboarding), Road Test, Hours of Service, Drug and Alcohol Testing (CDL drivers only), vehicle inspection requirements, CDL requirements (if applicable) and hazardous materials transportation/shipping training. Required for Certain Job Profiles: Drivers who operate Commercial Motor Vehicles with a Gross Vehicle Weight (GVW), Gross Vehicle Weight Rating (GVWR) or combination of power unit and trailer that meets or exceeds 10,001 lbs.
NewSenior Packaging Development Engineer Dormont Manufacturing CompanySenior Packaging Development EngineerOakland, CAThis role involves optimizing product lines, managing new developments, and collaborating closely with operations and suppliers to ensure efficiency and quality in packaging materials.#J-18808-Ljbffr. Dormont Manufacturing Co in Oakland, California is looking for a professional with a Bachelor's in mechanical or packaging engineering to evaluate and improve manufacturing processes.
Packaging Assembler Jess BusheyPackaging AssemblerPalo Alto, California$25–$30 / hourUltimate Staffing Services is actively seeking a dedicated Packaging Assembler for our client located in Palo Alto, California. This role is vital in supporting the packaging and labeling of medical device components within a regulated manufacturing environment.
Executive Director of R&D Engineering for 3DIC-Advance Packaging Synopsys IncExecutive Director of R&D Engineering for 3DIC-Advance PackagingSunnyvale, CALead the global engineering organization responsible for 3DIC silicon IP and advanced packaging design, covering layout, physical design, signal integrity, power integrity, thermal modeling, and mechanical stress analysis for AI infrastructure and HPC products. Experience working effectively in highly matrixed, global organizations, influencing across EDA development, product management, go-to-market, manufacturing, and customer success teams without direct reporting authority.
NewSenior Packaging Engineering Manager Injection Molding Keurig Dr PepperSenior Packaging Engineering Manager Injection MoldingSan Francisco, CAKeurig Dr Pepper in San Francisco is seeking an experienced Manager – Packaging Engineering to oversee packaging development in the U.S. Beverage Refreshments Packaging R&D team. The candidate should have 10-15 years of experience in packaging development, specializing in injection molding, tooling design, and sustainable practices.