IC Package Substrate Engineer Tesla IncIC Package Substrate EngineerPalo Alto, CA$188,000–$312,000 / yearBy creating custom silicon and optimized architectures, the team ensures Tesla remains a leader in AI-driven automotive and energy solutions, shaping a future where intelligent machines enhance human life. This role involves IC package substrate development for different system applications including driving substrate process optimization/ characterizations, substrate and package level test, data analysis and NPI/MP of new package substrates.
Power Module Mechanical Design Engineer Tesla IncPower Module Mechanical Design EngineerPalo Alto, CA$91,600–$316,800 / yearTake modules from prototype through high-volume manufacturing, applying direct experience with SiC or GaN power modules and automotive power electronics / traction inverter packaging where relevant. You ll lead module packaging design end-to-end, from first-principles concept to high-volume production, shaping the technology that powers every vehicle and energy product we ship.
Senior Integrated Photonics Engineer - Active Devices and Circuits PsiQuantum CorpSenior Integrated Photonics Engineer - Active Devices and CircuitsPalo Alto, CA$150,000–$185,000 / yearDeep expertise in integrated photonic devices-including both passive and active components-with a strong focus on electro-optic phase shifters and modulators (e.g., in thin-film lithium niobate, BTO, doped silicon, or III-V materials such as InP, GaAs, AlGaAs, InGaAsP); experience with high-speed operation (10 GHz bandwidth and beyond) is a strong plus. Our application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact.
Senior Laser & SOA Characterization Engineer LightmatterSenior Laser & SOA Characterization EngineerMountain View, CA$210,000–$267,000 / yearExperience operating optical and RF instruments, including laser current drivers, TEC controllers, OSAs, optical power meters, photodetectors, RF spectrum analyzers, oscilloscopes, bias tees, optical filters, polarization controllers, optical switches, and fiber-coupled components. In this role, you will lead advanced characterization, bring-up, validation, and root-cause analysis of semiconductor lasers, tunable laser sources, DFB lasers, external-cavity lasers, laser diodes, and semiconductor optical amplifiers.
Senior Package Reliability Engineer Altera SemiconductorSenior Package Reliability EngineerSan Jose, CaliforniaWith more than four decades of industry‑leading FPGA expertise, our singular mission is to deliver the programmable technologies that help customers differentiate, innovate, and scale across rapidly evolving markets like AI, cloud, networking, and edge. 8+ years of experience using thermal and thermomechanical simulation tools (e.g., Ansys, Abaqus, COMSOL, or equivalent) to develop and analyze warpage, coplanarity, stress, and deformation models for advanced semiconductor packages.
Advanced Package Design Engineer SKHYAAdvanced Package Design EngineerSan Jose, California$110,000–$155,000 / yearOur cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies.
Sr. Staff Engineer, Package and Interconnect Reliability Ayar LabsSr. Staff Engineer, Package and Interconnect ReliabilitySan Jose, CaliforniaYou will work closely with advanced foundry partners (including TSMC) to qualify advanced packaging technologies like COUPE (Compact Optical Engine), micro-bump/hybrid bonding, precision die attach, and critical optical-to-electrical interfaces such as Fiber Array Units (FAUs) and optical connectors. Failure Analysis & Physics of Failure (PoF) Root Cause Analysis: Drive deep-dive Failure Analysis (FA) on components that fail during reliability stress testing using advanced techniques (e.g., CSAM, High-resolution X-ray, SEM/EDX, FIB, and optical interferometry).
Senior Laser & SOA Characterization Engineer Lightmatter IncSenior Laser & SOA Characterization EngineerMountain View, CA$210,000–$267,000 / yearExperience operating optical and RF instruments, including laser current drivers, TEC controllers, OSAs, optical power meters, photodetectors, RF spectrum analyzers, oscilloscopes, bias tees, optical filters, polarization controllers, optical switches, and fiber-coupled components. In this role, you will lead advanced characterization, bring-up, validation, and root-cause analysis of semiconductor lasers, tunable laser sources, DFB lasers, external-cavity lasers, laser diodes, and semiconductor optical amplifiers.
Advanced Package Design Engineer SK hynixAdvanced Package Design EngineerSan Jose, CaliforniaOur cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies.