Advanced Packaging Process Integration Engineer IntelAdvanced Packaging Process Integration EngineerRio Rancho, New MexicoBachelor's degree in Engineering, Material Science, Physics, or a related field with 4 or more years of relevant experience, or a Master's degree in Engineering, Material Science, Physics, or a related field with 3 or more years of relevant experience, or a PhD in Engineering, Material Science, Physics, or a related field with no experience. This role offers an exciting opportunity to define and execute technology transfer roadmaps, enabling the seamless integration of advanced packaging and backend assembly-test processes from new product introduction (NPI) to high-volume manufacturing (HVM) ramp.
Advanced Packaging Metro Module Engineer IntelAdvanced Packaging Metro Module EngineerRio Rancho, New MexicoLead efforts to install, convert, and qualify equipment during factory ramps, ensuring tools are installed safely, on schedule, and meet quality and matching criteria. This position provides you with an exciting opportunity to support the development and ramp-up of high-volume manufacturing processes supporting Intel's next generation of advanced packaging technologies such as FOVEROS-S and EMIB.
Advanced Packaging Singulation Module Engineering Manager IntelAdvanced Packaging Singulation Module Engineering ManagerRio Rancho, New MexicoJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, New Mexico, Albuquerque Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Advanced Packaging Senior Yield Analysis Intel Corp.Advanced Packaging Senior Yield AnalysisAlbuquerque, NM$164,470–$232,190 / yearMinimum qualifications: Bachelor's degree with at least 6 years of relevant experience, or Master's degree with at least 4 years of relevant experience, or PhD with at least 2 years of relevant experience in Materials Science and Engineering, Mechanical Engineering, Computer Science, Information Systems, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field. Job Details: Job Description: Advanced Packaging Technology and Manufacturing (APTM) Yield Group is looking for a Yield Analysis engineer to join our team tasked with the objective of driving yield and defect improvement across APTM portfolio of packaging technologies.
Advanced Packaging Singulation Engineer IntelAdvanced Packaging Singulation EngineerRio Rancho, New Mexico$120,860–$170,630 / yearAnnual Salary Range for jobs which could be performed in the US: $120,860.00-170,630.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. This role offers an exciting opportunity to work at the forefront of high-volume manufacturing, playing a pivotal role in enabling rapid device miniaturization and the mass production of integrated circuits.
Packaging Associates ResourceMFGPackaging AssociatesAlbuquerque, NMFull timeTake the first step toward a stable career — gain hands-on experience, steady income, and real growth potential with Employbridge. Ability to perform basic mathematical equations, read, and understand measurements.
NewPackaging Associate Verdes CannabisPackaging AssociateAlbuquerque, NM$18Responsibilities include operating packaging machinery, maintaining accurate records, inspecting inventory and keeping the workspace clean and organized. Our team members exceed expectations, improve every day, show initiative, demonstrate integrity, engage in courageous conversations and respond within 24 hours.
Wafer Packaging Manufacturing - Wafer Level Assembly Department Manager Intel Corp.Wafer Packaging Manufacturing - Wafer Level Assembly Department ManagerAlbuquerque, NM$191,220–$269,950 / yearThis position requires close collaboration with stakeholders across many organizations including Assembly Test Manufacturing (ATM), Global Supply Chain (GSC), Manufacturing Integration Technology (MIT), Customer Quality Network (CQN), Environment, Health & Safety (EHS), Factory Systems Manufacturing (FSM), Logic Technology Development (LTD), Sort Technology Development (STTD), Assembly Test Technology Development (ATTD). Demonstrated the capability of working in a high performing team culture which includes: setting high expectations, driving performance to those expectations with a high sense of urgency, role modeling the desired culture, possessing excellent teamwork and leadership skills, and demonstrated problem solving and prioritization skills.