Silicon Packaging Design Engineer IntelSilicon Packaging Design EngineerChandler, ArizonaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: US, Oregon, Hillsboro Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Packaging Module Equipment Development Engineer Intel CorpPackaging Module Equipment Development EngineerChandler, AZ$133,800–$188,890 / yearThe Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by: Developing First Level/Second Level Interconnect (FLI/SLI), Thermal solutions (TIM1), and SMT/PCB technologies to support Intel's future packaging platforms. Job Details: Job Description: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.
Packaging Module Development Engineer IntelPackaging Module Development EngineerChandler, ArizonaBachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field with 1+ years of relevant experience or Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field. Job Description: Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies.
Advanced Packaging Reliability Lab Engineer IntelAdvanced Packaging Reliability Lab EngineerChandler, ArizonaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Responsibilities will include but not be limited to: - Characterization of equipment performance and response to excursions/issues - Continuous improvement of methods, specifications, and training - Development, analysis, and implementation of statistical process control - Translation of reliability stress analysis requirements into fixturing and development of new tools, systems, and other innovative solutions - Coordination of tool vendors and field service engineers - Collaboration with internal operations, planning, and facilities teams Qualifications:
NewAdvanced Packaging Intern, MS - Summer 2027 Marvell TechnologyAdvanced Packaging Intern, MS - Summer 2027Chandler, CaliforniaThis role is eligible to participate in Marvell's bonus and equity plans, including a new hire equity grant and annual equity refreshers, ensuring you are rewarded for your contributions and remain invested in the company's long-term success. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
Packaging Equipment Development Group Lead IntelPackaging Equipment Development Group LeadChandler, Arizona$180,770–$255,200 / yearThis group focuses on developing industry-leading packaging solutions to support Intel's product roadmap, fostering innovation, optimizing manufacturing equipment, and enabling high-volume production. In this role, you will oversee new equipment introductions, ensure seamless integration of equipment and processes, and lead your team in solving complex challenges to deliver world-class manufacturing solutions.
Substrate Packaging Defect Metro Tool Owner IntelSubstrate Packaging Defect Metro Tool OwnerChandler, ArizonaDirect next-generation tool installation, reaching major milestones-purchase-spec development, source inspection, design, pre-fac, Safety level approval, Supplier qual, Intel qual, etc.-by collaborating with diverse stakeholders. In this role, you will help drive innovation in EMIB-T, glass core, EMIB scaling, and panel-level packaging technologies for substrate as well as assembly test mfg (ATM) factories for Intel's IPG and IFS customers.
Customer Program Manager, International Packaging Veritiv CorpCustomer Program Manager, International PackagingChandler, AZJob Responsibilities: SOW development, project planning, scheduling, progress tracking/monitoring, resource assignment, risk management, scope management, driving the teams, carrying out the projects against committed goals, managing project members and dependencies and presenting to internal teams and where needed, external partners. Work closely with adjacent functional groups such as Sales, Engineering, Supply Chain, Manufacturing, and Marketing to coordinate interdepartmental activities ensuring the completion of the project on schedule and within the customer parameters.
Packaging Associate Gummi WorldPackaging AssociateChandler, AZWe’re currently hiring Packaging Line Operators and Team Members who are excited to grow with us, thrive in a collaborative environment, and take pride in producing products that make a difference in people’s lives. Set up, operate, and monitor packaging machinery (bottle fillers, cappers, labelers, sealers, pouch fillers, etc.).
Packaging Lead Bright Innovation LabsPackaging LeadCoolidge, AZFull timeThe Production Line Leader position is accountable for ensuring that production is executed in a timely manner and performs regular quality control assessments to produce excellent quality output, minimize delays and reach production goals. While performing the duties of this job, employee is regularly required to stand and walk for prolonged periods of time, employee must be able to bend, reach, pull and lift to 40 pounds.
ATD MIHL Equipment Development Engineer IntelATD MIHL Equipment Development EngineerChandler, ArizonaThis group collaborates with cross-functional teams to drive innovation in manufacturing processes, enhance product reliability, and support Intel's broader mission of delivering world-class technologies. Your work will directly impact manufacturing efficiency, product reliability, and technological advancements, ensuring Intel maintains its position as a global leader in the semiconductor industry.
ATD Laser Development Engineer IntelATD Laser Development EngineerChandler, ArizonaYour work will directly impact the performance, quality, and reliability of Intel's assembly and packaging solutions, driving advancements in technology that address the dynamic needs of the semiconductor industry. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
Test Module Development Engineer Intel CorpTest Module Development EngineerChandler, AZPrimary Focus: • Advanced semiconductor packaging technologies beyond conventional approaches • 3D packaging innovations and chiplet integration • High-performance computing packaging for data centers and AI applications • Heterogeneous integration across diverse chip technologies • Scaling packaging density while enhancing thermal and electrical performance. Test Module Development Engineer responsibilities include but are not limited to: • Executes test technology development and enablement for high-mix, low-volume testing and future technologies, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.