Hillsboro, OR30+ days ago
Specific responsibilities to include: • Work with product architects to determine the optimal packaging solution • Drive package technology solutions for chiplet architecture with advanced packaging • Drive supplier assessments and manage suppliers through definition, development, qualification and production • Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options • Define, design and develop test vehicles to validate Silicon, Package, System performance • Support substrate design working with suppliers and internal teams • Assess and characterize the reliability of Integrated Circuits (IC) packages • Design and develop package and assembly drawings to support the manufacturing • Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers • Drives the execution of architecture solutions across product lines or multiple product groups and across teams that account for design trends and future concepts by leveraging cross-functional expertise, industry best practices, and lessons learned from teams working across multiple product lines • Drives engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs. Preferred Qualifications: • Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience • Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience • Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience • Master's Degree with 10 years experience in semiconductor package product development • 5+ years hands-on experience in Semiconductor Package development, manufacturing, supplier management or quality management • Specific experience with Advanced Semiconductor Package technologies (e.g.