Material Characterization: Define and implement material constitutive models (elastic, plastic, viscoelastic, etc.) for various packaging materials (EMC, Substrate, Silicon, TIM) and correlate simulation results with empirical data (e.g., Shadow Moire, DIC). Advanced FEA Modeling: Develop high-fidelity, non-linear Finite Element Analysis (FEA) models to characterize stress, strain, and warpage behavior in advanced semiconductor packages during assembly processes and reliability tests.