NewFlexible Packaging Engineer Destiny Packaging Inc.Flexible Packaging EngineerSalinas, CAPart timeUnderstanding of the chemistry of poly urethane, poly vinyl, and poly olefin films, single direction and bi-directional shrink films, barrier and co extruded poly films is preferred. Experience with MAP, barrier films, laminated structures, COEX films, SUPs, flexo print, shrink, stretch, and poly bag structures is preferred.
Flexible Packaging Engineer BUNZLFlexible Packaging EngineerSalinas, CA$75,000–$80,000 / yearUnderstanding of the chemistry of poly urethane, poly vinyl, and poly olefin films, single direction and bi-directional shrink films, barrier and co extruded poly films is preferred. With more than 10,000 team members and over 400,000 supplies, Bunzl is recognized as a leading supplier across North America—and proudly certified as a Great Place to Work® .
Integrated Circuit - Packaging Architect Engineer Advanced Micro Devices, IncIntegrated Circuit - Packaging Architect EngineerSan Jose, CaliforniaSuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. Responsibilities: The Role : Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
Packaging Design Engineer Advanced Micro Devices, IncPackaging Design EngineerSan Jose, CaliforniaThis role requires good communication skills to work with other teams and engineers at the various design centers to carry the projects from design start to signoff stages. The AECG - Embedded Team builds and optimizes platforms for embedded and commercial applications, working across silicon, firmware, and software to deliver reliable, high‑performance solutions at scale.
Lab Packaging Test Engineer I Engineer In Training (Swing Shift) Artech LLCLab Packaging Test Engineer I Engineer In Training (Swing Shift)San Jose, CA$66,560–$70,720 / yearPerform testing duties within the designated workday hours according to requirements to ensure customer objectives are met through proactive communication, documentation, and customer service. Maintain responsive customer communication in email and in person regarding testing services provided, test status, updates, and results.
Packaging Tech B Fresh ExpressPackaging Tech BSalinas, CAFull timeMinimum 2-4 years experience with industrial, high-speed processing, packaging, weighing, filling and inspection equipment OR minimum one-year technical training/schoolHigh School diploma or equivalency (such as a Technical degree) required; specific technical training to support the Maintenance skill summary. Packaging Tech Position Summary:Packaging Technician is responsible for safely maintaining, repairing, replacing and modifying all processing, packaging and facility equipment with optimal quality and efficiency.
Packaging Tech Lead Design Engineer Astera LabsPackaging Tech Lead Design EngineerSan Jose, CA$185,000–$240,000 / yearAstera Labs' Intelligent Connectivity Platform integrates CXL, Ethernet, NVLink, PCIe, and UALink semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.
Optical-Electronic Packaging Engineer Lumentum Inc.Optical-Electronic Packaging EngineerSan Jose, CAWith our continual goal of making Lumentum a best place to work for our employees, we strive to offer employees competitive total compensation packages, which may include annual bonus, commission for certain sales roles, equity, and health and welfare benefits. This role focuses on advanced mechanical and thermal packaging solutions for high-density, high-power optical modules, including pluggable form factors and emerging advanced packaging architectures.
Advanced Package Engineer, Principal Astera LabsAdvanced Package Engineer, PrincipalSan Jose, CA$185,000–$240,000 / yearAstera Labs' Intelligent Connectivity Platform integrates CXL, Ethernet, NVLink, PCIe, and UALink semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.
Silicon Photonics PIC Design Engineer Broadcom CorporationSilicon Photonics PIC Design EngineerSan Jose, CA$143,800–$230,000 / yearAs a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. In this role, you will lead the design, simulation, layout, and system-level testing of advanced silicon photonics components that power our high-performance optical interconnect solutions.
Advanced Package Design Engineer SK hynixAdvanced Package Design EngineerSan Jose, CA$110,000–$155,000 / yearOur cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies.
R&D Engineer IC Design Broadcom CorporationR&D Engineer IC DesignSan Jose, CA$120,000–$192,000 / yearStrong automation expertise related to bump pattern generation, routing structure development for high speed interfaces, and chip finishing are required to handle multiple Interposer designs in parallel. You will be working on designing interposers starting with custom routing for high speed interfaces, bump map design, routing and physical verification and tapeout to the foundries.