Assembly Packaging Technical Integrator - Intel Foundry Services MAG Intel CorpAssembly Packaging Technical Integrator - Intel Foundry Services MAGHillsboro, OR$164,470–$232,190 / yearp>Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Technical knowledge and firsthand experience are critical for effective integration of cross functional efforts including Assembly Process technology, Package assembly Design Technology, design services, statistical model-based analysis and Yield and package reliability analysis.
Packaging Engineer International Flavors & Fragrances IncPackaging EngineerOR$91,744–$114,680 / yearThe Packaging Engineer will provide technical leadership for global finished format packaging operations, including oversight of equipment, packaging materials, and inputs to contract manufacturing partners. Serve as the subject matter expert for finished format packaging equipment (bottling, blister, stick pack, sachet, etc.) and packaging materials across global operations.
Senior Packaging Engineer GenentechSenior Packaging EngineerHillsboro, Oregonp style="text-align:inherit"/>If you have a disability and need an accommodation in relation to the online application process, please contact us by completing this form Accommodations for Applicants. Hillsboro Technical Operations (HTO) is a drug product & finished goods manufacturing organization responsible for the reliable delivery of Roche’s commercial portfolio & pipeline products.Silicon Packaging Engineering Manager Intel CorpSilicon Packaging Engineering ManagerHillsboro, OR$190,610–$269,100 / yearp>Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Minimum Qualifications: Bachelor's degree in Electrical Engineering or STEM related field with 9+ years of relevant experience OR- Master's degree in Electrical Engineering or STEM related field with 6+ years of relevant experience OR- PhD in Electrical Engineering or STEM related field with 4+ years of relevant experience.Load moreResume ResourcesFree Resume TemplatesFree Resume Builder
Silicon Packaging Engineering Manager Intel CorpSilicon Packaging Engineering ManagerHillsboro, OR$190,610–$269,100 / yearp>Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Minimum Qualifications: Bachelor's degree in Electrical Engineering or STEM related field with 9+ years of relevant experience OR- Master's degree in Electrical Engineering or STEM related field with 6+ years of relevant experience OR- PhD in Electrical Engineering or STEM related field with 4+ years of relevant experience.