RESPONSIBILITIESOwn packaging assembly processes from concept to mass production, including equipment and material selection for wafer‑level and chip‑level systemsDevelop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, surface mount technology (SMT), flip chip, bonding, molding, underfill, dispense, sputter, lid attach, solder ball attach, and advanced packaging processesOwn packaging prototypes, product development, release to production, and process sustainment in a high‑volume production environmentDevelop, document, implement, and monitor Out of Control Action Plan (OCAP), Statistical Process Control (SPC) and defect yield paretos to drive continuous improvementCross‑functional interface with silicon design, materials, thermal, systems, and production teamsImplement advanced packaging solutions into SpaceX next generation products on Earth, in orbit, and beyondTroubleshoot equipment malfunctions, analyze process drifts, and perform root cause investigations to minimize defects and enhance operational excellenceDocument process data, prepare reports on key metrics, and contribute to design of experiments (DOE) for process enhancementsAssist in tool installations, preventive maintenance, and qualification testing to support high‑volume production and rapid prototypingProvide detailed documentation of procedural steps and training aids for team of production specialists, technicians, and associatesMonitor adherence to protocols and provide individual remediation as necessaryBASIC QUALIFICATIONSBachelor's degree in an engineering, math, or science discipline1+ years of experience in a manufacturing environment via professional work experience, project/research‑based student experience, or a combination of bothPREFERRED SKILLS AND EXPERIENCEBachelor's degree in materials science, mechanical engineering, electrical engineering, chemical engineering, or a related field3+ years of practical experience in semiconductor manufacturing processes in a fab settingProficiency in data analysis and process control software (e.g., JMP, SQL) for statistical process control (SPC) and trend analysisExperience in New Product Integration (NPI) activities, First Article Verification Processes (FAIR), and scaling into High Volume Manufacturing (HVM) as part of cross‑functional teamsADDITIONAL REQUIREMENTSMust be able to work all shifts and be willing to work overtime and/or weekends as neededAble to travel up to 10% as needed for vendor engagement and Factory Acceptance TestingStanding for long periods of time, climbing up and down ladders, bending, grasping, sitting, pulling, pushing, stooping, and stretching may be required to perform the functions of this positionMust be able to lift up to 25lbs. unassistedITAR REQUIREMENTSTo conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. * 1157, or (iv) Asylee under 8 U.S.C. * 1158, or be eligible to obtain the required authorizations from the U.S. Department of State.