Packaging Associate Hexcel CorporationPackaging AssociateBurlington, WA$20.96–$28.50 / hourFull timeHexcel also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work. With our strong investment in research and development and our culture of continuous improvement, Hexcel is the industry leader in the manufacturing of advance composite materials, including carbon fiber, woven reinforcements, resins, prepregs, honeycombs and additive manufactured parts.
Sawyert/Material Handler/Packaging - Ready-Frame BFS Group LLCSawyert/Material Handler/Packaging - Ready-FrameArlington, WAFull timeThis role is a safety sensitive position for which impairment while working presents a substantial risk of death, which means candidates must complete our pre-employment drug testing process, which includes marijuana. At BFS, you'll be equipped with all the tools, training, and resources you need, and you'll be empowered to try new things, gain new experiences, and build a career with unlimited horizons.
Packaging Engineer (Bothell, WA) PhilipsPackaging Engineer (Bothell, WA)Bothell, WA$103,000–$177,000 / yearAs a Packaging Engineer, you will manage Oral Healthcare packaging execution projects with the Philips Project Management Team, internal marketing, purchasing, System Engineers/Quality and suppliers. The actual base pay offered may vary within the posted ranges depending on multiple factors including job-related knowledge/skills, experience, business needs, geographical location, and internal equity.
Senior IC Packaging Engineer Microsoft CorpSenior IC Packaging EngineerRedmond, WA$119,800–$234,700 / yearPreferred Qualifications: Doctorate in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 3+ years technical engineering experience OR Masters Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 8+ years technical engineering experience OR equivalent experience. Required Qualifications: Doctorate in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 1+ year(s) technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 4+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 5+ years technical engineering experience OR equivalent experience.
Principal Power Electronics Packaging Engineer Helion Energy IncPrincipal Power Electronics Packaging EngineerEverett, WASince Helions founding in 2013, we have raised over $1 billion from long-time investors such as Sam Altman, Mithril, and Capricorn Investment Group as well as new investors SoftBank and Lightspeed to propel us forward. Our last prototype, Trenta, completed 10,000 high-power pulses and reached plasma temperatures of 100 million degrees Celsius (9 keV).
Structural Packaging Engineer NintendoStructural Packaging EngineerRedmond, WashingtonRemoteHere at Nintendo of America Inc., we deliver on this mission by partnering closely with Nintendo Co., Ltd., to bring Nintendo’s iconic and cherished franchises including Mario , Donkey Kong , The Legend of Zelda , Metroid , Animal Crossing , Pikmin and Splatoon across the Americas through our video games, hardware systems, and collaborations with partners on a range of other entertainment initiatives like feature films and theme parks. Provides technical or mechanical support to internal and external teams to ensure products are manufactured and packaged in accordance to specifications.
Principal Power Electronics Packaging Engineer HelionPrincipal Power Electronics Packaging EngineerEverett, WashingtonSince Helion's founding in 2013, we have raised $1.5 billion from long-time investors such as Sam Altman, Mithril, and Capricorn Investment Group as well as new investors including Thrive Capital, LightSpeed Venture Capital, SoftBank, and others to propel us forward. We are looking for someone to design what the next generation of packaging looks like, working ahead of where technology currently is and defining what it needs to become.
Semiconductor Packaging Engineer Sigma DesignSemiconductor Packaging EngineerRedmond, WAFull timeExperience working with back-end-of-line (BEOL) and advanced packaging processes including technologies such as thinning, grinding, dicing, soldering, eutectic bonding, electrochemical deposition or metal finishing, through-silicon vias (TSV), flip-chip bonding, wire or die bonding, bumping, thermocompression bonding, copper pillar bonding, hybrid bonding, underfill processes, and overmolding or encapsulation. Essential Job Functions - Responsibilities: Lead assembly and integration engineering efforts with emphasis on Surface Mount Technology (SMT), Die Bond/Wire Bond processes, and support activities related to molding, laser fabrication, panel or wafer lamination, and component thinning, planarization, and dicing.
Semiconductor Packaging Engineer Sigma Design.Semiconductor Packaging EngineerRedmond, WA$115,000–$140,000 / yearExperience working with back-end-of-line (BEOL) and advanced packaging processes including technologies such as thinning, grinding, dicing, soldering, eutectic bonding, electrochemical deposition or metal finishing, through-silicon vias (TSV), flip-chip bonding, wire or die bonding, bumping, thermocompression bonding, copper pillar bonding, hybrid bonding, underfill processes, and overmolding or encapsulation. Essential Job Functions - Responsibilities: Lead assembly and integration engineering efforts with emphasis on Surface Mount Technology (SMT), Die Bond/Wire Bond processes, and support activities related to molding, laser fabrication, panel or wafer lamination, and component thinning, planarization, and dicing.
Distribution Coordinator/Flex - packaging Buddies Administrative Services, Inc.Distribution Coordinator/Flex - packagingLake Stevens, WA$20–$25 / hourFull timeThis role is responsible for coordinating outgoing shipments, maintaining inventory accuracy, preparing orders, and ensuring all products are processed efficiently and compliantly. This position is ideal for someone who thrives in a hands-on environment, values organization and accuracy, and enjoys working collaboratively to meet operational goals.
Fish Processing Packaging ManpowerFish Processing PackagingEverett, WAFull timeManpowerGroup® (NYSE: MAN), the leading global workforce solutions company, helps organizations transform in a fast-changing world of work by sourcing, assessing, developing, and managing the talent that enables them to win. We are recognized consistently for our diversity - as a best place to work for Women, Inclusion, Equality and Disability and in 2023 ManpowerGroup was named one of the World's Most Ethical Companies for the 14th year - all confirming our position as the brand of choice for in-demand talent.
Packaging Operator, Morning Shift Factors Group Of Nutritional Companies IncPackaging Operator, Morning ShiftMonroe, WA$20.45–$23.14 / hourAfter that five days, Internal applicants will be considered along with all other applicants; however, are guaranteed at minimum a call from the Talent Acquisition team. This position is open to all qualified applicants who are legally entitled to work in the country in which this job is located.
Packaging Operator, Afternoon Shift Factors Group Of Nutritional Companies IncPackaging Operator, Afternoon ShiftMonroe, WA$21.45–$24.14 / hourAfter that five days, Internal applicants will be considered along with all other applicants; however, are guaranteed at minimum a call from the Talent Acquisition team. This position is open to all qualified applicants who are legally entitled to work in the country in which this job is located.
Director, Pricing & Packaging Tanium IncDirector, Pricing & PackagingWA$206,000–$316,000 / yearThis position follows the Company's hybrid schedule which currently requires employees to work in the office at one of the following locations a minimum of three days per week: Addison, TX; Bellevue, WA; Durham, NC; Emeryville, CA; or Reston, VA. Many of the world's leading organizations trust Tanium's single, unified platform for endpoint management and security to innovate faster, stay resilient and move business forward with confidence, at scale.
Sr. Category Manager, Packaging, Global Procurement Operations (GPO) AmazonSr. Category Manager, Packaging, Global Procurement Operations (GPO)Bellevue, WAKey Job Responsibilities: - Establish category sourcing strategies, lead cross-functional strategic sourcing teams, negotiate with suppliers and execute contracts to optimize Amazon's competitive position - Drive appropriate relationships with category suppliers, with a principal objective of achieving the optimal solution and cost of ownership that meets the business' goals supported by a culture of continuous improvement with performance benchmarks in use - Manage category suppliers to proactively identify, monitor and optimize opportunities - Act as a market intelligence provider regarding categories; anticipate strategic opportunities and keep key stakeholders informed - Drive category suppliers in Supplier Relationship Management activities to mitigate risk, improve performance and add value to Amazon - Identify, achieve and report on savings and value targets for category sourcing activities - Align with internal customers and understand the business application of the category Key Performance Indicators: - Earn the trust of key stakeholders to drive alignment with the business - Create a category strategy in conjunction with internal customers to ensure there is a comprehensive, unified approach for the category. USA, AZ, Tempe - 115,400.00 - 160,000.00 USD annually USA, TN, Nashville - 103,900.00 - 148,400.00 USD annually USA, TX, Houston - 115,400.00 - 160,000.00 USD annually USA, VA, Arlington - 115,400.00 - 160,000.00 USD annually USA, WA, Bellevue - 115,400.00 - 160,000.00 USD annually
Staff Software Engineer, Gemini Enterprise App, Cloud AI Google LLCStaff Software Engineer, Gemini Enterprise App, Cloud AIKirkland, WAWe"re looking for engineers who bring fresh ideas from all areas, including information retrieval, distributed computing, large-scale system design, networking and data storage, security, artificial intelligence, natural language processing, UI design and mobile; the list goes on and is growing every day. Experience with internal Google-scale distributed data technologies and pipeline frameworks (e.g., Flume, Dream-pipe, Conduit, or SQL Pipelines) to build data warehousing solutions, analytics APIs, or customer-facing dashboards.
GTM Sales Specialist, Databases, Google Cloud Google LLCGTM Sales Specialist, Databases, Google CloudKirkland, WAAs a Go-to-Market Sales Specialist, you will be leading go-to-market strategies and business engagements, managing focused business campaigns, and providing feedback to Product and Global Solutions teams to inform our product solutions roadmap. As part of an entrepreneurial team in this rapidly growing business, you will play a key role in understanding the needs of our customers and help shape the future of businesses of all sizes use technology to connect with customers, employees and partners.
Principal Signal and Power Integrity Engineer Microsoft CorpPrincipal Signal and Power Integrity EngineerRedmond, WA$142,800–$274,800 / yearRequired Qualifications: Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. Drives the execution of architecture solutions across product lines or multiple product groups across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry practices, and lessons learned from teams working across multiple product lines.