Packaging Integration Engineer GlobalFoundries IncPackaging Integration EngineerEssex Junction, VT$143,000–$247,000 / yearYou will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets. As a Packaging Engineer within GF's Integrated Optics organization, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms.
Advanced Packaging Process Integration Engineer GlobalFoundries IncAdvanced Packaging Process Integration EngineerEssex Junction, VT$143,000–$247,000 / yearAbout GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets.
MTS Packaging Integration Engineer GlobalFoundries IncMTS Packaging Integration EngineerEssex Junction, VTIt is expected that options for optical fiber attach will include detachable fiber optic couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters which must be compatible with 3D electrical interconnect solutions including Copper RX, Copper uPillar, chip-on-wafer hybrid bonding and wafer-to-wafer hybrid bonding. • Provides tools and complex analysis of quality issues and associated financial implications • Protects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customers and market to avoid costly re-designs.
PMTS Silicon Photonics Packaging Integration GlobalFoundries IncPMTS Silicon Photonics Packaging IntegrationEssex Junction, VTAbout GlobalFoundries: • GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the worlds most inspired technology companies. Summary of Role: As a Photonic Packaging Engineer within GFs APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms.
Pmts Silicon Photonics Packaging Integration Global FoundriesPmts Silicon Photonics Packaging IntegrationEssex Junction, VT$131,900–$241,500 / yearAbout GlobalFoundries: GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. Summary of Role: As a Photonic Packaging Engineer within GF's APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms.
Packaging Engineer Keurig Dr Pepper IncPackaging EngineerEssex Junction, VT$90,000–$115,000 / yearThis role serves as the site subject matter expert for packaging technologies and works closely with Operations, Engineering, Maintenance, Quality, R&D, Commercialization, and Supply Chain teams to improve packaging performance, reliability, and throughput. The Packaging Engineer leads continuous improvement initiatives, supports capital projects, drives equipment and process optimization, and ensures packaging systems meet safety, quality, operational, and financial objectives.
Pmts Photonics Packaging Design Integration Global FoundriesPmts Photonics Packaging Design IntegrationEssex Junction, VT$131,900–$241,500 / yearFocus on product and module performance, reliability, packaging design rules, materials selection criteria, definition of electrical, photonic and thermal definition for chiplet and product modules as well as reliability qualification approaches. Summary of Role: As a Photonic Packaging Design Integration Engineer within GF's APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms.
PMTS Photonics Packaging Design Integration GlobalFoundries IncPMTS Photonics Packaging Design IntegrationEssex Junction, VT$131,900–$241,500 / yearFocus on product and module performance, reliability, packaging design rules, materials selection criteria, definition of electrical, photonic and thermal definition for chiplet and product modules as well as reliability qualification approaches. Summary of Role: As a Photonic Packaging Design Integration Engineer within GF's APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms.
Packaging Integration Engineer (2026 New College Graduate) GlobalFoundries IncPackaging Integration Engineer (2026 New College Graduate)Essex Junction, VT$85,000–$146,000 / yearEducation - Graduating with a Bachelors, Master's, or PhD degree in Materials Science Engineering, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, or a related STEM discipline from an accredited degree program. Basic understanding of semiconductor packaging, silicon photonics, materials science, reliability, manufacturing processes, or related technologies gained through coursework, research, internships, co-ops, or academic projects.
Packaging Design Integration Engineer (2026 New College Graduate) GlobalFoundries IncPackaging Design Integration Engineer (2026 New College Graduate)Essex Junction, VT$85,000–$146,000 / yearEducation - Graduating with a Bachelor's, Master's, or PhD degree in Mechanical Engineering, Electrical Engineering, Materials Science Engineering, Chemical Engineering, Physics, Optical Engineering, or a related STEM discipline from an accredited degree program. Basic understanding of semiconductor packaging, silicon photonics, chip package co-design, modeling/simulation, materials science, reliability, or manufacturing processes gained through coursework, research, internships, co-ops, or academic projects.
Advanced Packaging Intern, MS - Summer 2027 MarvellAdvanced Packaging Intern, MS - Summer 2027Burlington, VTThis role is eligible to participate in Marvell's bonus and equity plans, including a new hire equity grant and annual equity refreshers, ensuring you are rewarded for your contributions and remain invested in the company's long-term success. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
Advanced Packaging Design Verification & Physical Validation Engineer MarvellAdvanced Packaging Design Verification & Physical Validation EngineerBurlington, VTPhysical Verification Execution: Own and execute comprehensive PKG floor-planning Checks, DRC (Design Rule Checking), LVS (Layout Versus Schematic), and DFM (Design for Manufacturability) flows for complex, multi-die advanced packaging architectures. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
Advanced Packaging Cryogenic Modeling Engineer GlobalFoundries IncAdvanced Packaging Cryogenic Modeling EngineerEssex Junction, VT$118,000–$239,000 / yearThe engineer will leverage commercial multi-physics tools to build, correlate, and apply models that capture low-temperature material property behavior and thermo-mechanical effects (e.g., thermal contraction and CTE mismatch) to guide device, integration, and cryogenic 3DHI advanced packaging optimizations for mechanical, thermal, and/or electrical performance. About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the worlds most inspired technology companies.
Quantum Advanced Packaging Manager GlobalFoundries IncQuantum Advanced Packaging ManagerEssex Junction, VT$118,000–$210,000 / yearThe role will entail leading the Quantum advanced packaging team to develop various cryogenic / superconducting capabilities, such as wafer-to-wafer (W2W) hybrid / fusion bonding, die-to-wafer (D2W) hybrid bonding, interposers, etc. GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies.
Ph.D. Intern - Advanced Packaging & Physical Integration MarvellPh.D. Intern - Advanced Packaging & Physical IntegrationBurlington, VTThe team developed an industry-first modular RDL interposer platform that enables multi-die AI accelerator designs 2.8x larger than the largest possible single-chip implementation - integrating over 1,390mm² of silicon alongside HBM3/3E memory stacks across six redistribution layers, with shorter die-to-die interconnects and supply chain flexibility that traditional silicon interposers cannot match. The problems this team works on - signal integrity at 224G+ SerDes speeds across multi-die substrates, power delivery for XPU packages approaching 1,000W, thermal management for chiplet stacks with HBM, mechanical reliability across advanced 2.5D and 3D integration schemes - are among the most technically demanding in the semiconductor industry.
Advanced Packaging Intern, BS - Summer 2027 MarvellAdvanced Packaging Intern, BS - Summer 2027Burlington, VTThis role is eligible to participate in Marvell's bonus and equity plans, including a new hire equity grant and annual equity refreshers, ensuring you are rewarded for your contributions and remain invested in the company's long-term success. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
Account Manager - Packaging/Labeling Multi-Color CorpAccount Manager - Packaging/LabelingGeorgia, GAThis role is primarily office-based or home office-based, requiring extended periods of sitting, computer use, occasional walking or light lifting, and may involve brief visits to manufacturing areas; reasonable accommodations will be provided as needed. This position defines long-term organizational strategic goals, builds key customer relationships, identifies business opportunities, negotiates and closes business deals and maintains extensive knowledge of current market conditions.
Lead Solutions Design Engineer - SIMIO Warehouse & Transportation Simulation (REMOTE) Ryder System IncLead Solutions Design Engineer - SIMIO Warehouse & Transportation Simulation (REMOTE)Montpelier, VTRemoteWarehouse Design:Extensive knowledge of Warehouse Management operations, data analytics, Industrial Engineering, warehouse types (ambient, temp control, warehouse layout/ design and Lean methodsRequired knowledge of material handling solutions and automation types such as: powered industrial truck (PIT) applications; racking and other storage solution designs, packaging equipment; conveyor and sortation equipment; and other automation solutions (e.gAS/RS)Warehouse Design Tools e.g. Transportation Design:Extensive knowledge of Dedicated Services and Managed Transportation NetworksRequired knowledge of all available equipment types such as; dry van, temperature control, flat bed, other specialized equipmentTransportation Design Tools ie; JDA, Appian, Network Design Tools ie; Llamasoft, Transportation Management Systems ie; JDA, OTM,, Mapping Software ie; Tableau expert required.