NYC is a diverse consortium, and you will have many opportunities to work closely with suppliers and other companies while protecting Micron's intellectual property (IP).Responsibilities:Develop, qualify, and sustain dry etch (plasma) unit processes for advanced memory technologies (e.g., dielectric, conductor, and hardmask etch)Optimize critical process metrics including CD control, etch profile/anisotropy, selectivity, microloading, uniformity, and line edge/line width roughnessDrive defect reduction and yield improvement using inline/out-of-line metrology, DOEs, SPC, and statistical data analysisPerform root-cause analysis and implement corrective actions for process excursions, tool health issues, and integration-related failuresPartner with equipment vendors on chamber matching, hardware and recipe development, new capability evaluations, and cost-of-ownership improvementsDocument process baselines, change controls, and learning; communicate results and support technology transfer to high-volume manufacturingMinimum Qualifications:M.S. or Ph. You will collaborate with our EUV Photo Lithography process team in NYC, and our Technology Development (TD) teams in Boise, USA and Hiroshima, Japan sites to develop robust dry etch solutions aligned to Micron's technical roadmap.