NewHBI Module Development Engineer INTELHBI Module Development EngineerVernonia, OR$172,200–$243,000 / yearAs a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
Automation Engineer BlueScope Steel LtdAutomation EngineerWA$122,000–$138,000 / yearWe're committed to being leaders in creating and inspiring metal into a wide range of finished products including metal roofing, siding and decking - building beauty and strength in our communities. Joining the CPNA team means you'll play your part in our ongoing success as we consistently deliver for our customers and strengthen our communities, now and into the future.