Develop new technologies and establish baselines for assembly and packaging including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach. Packaging familiarity with flip-chip, BGA, fcCSP, WLCSP, fan out FO processes, system-in-package SiP, multi-chip modules MCM, panel level packaging, heterogenous and chiplet integration.