Perform root cause analysis and lead corrective actions for quality issues, with focus on common PCB defect modes and failure mechanisms such as delamination, plating voids or thin plating, open/short circuits, warpage, copper thickness variation, solder mask defects, impedance drift, CAF (conductive anodic filament), pad cratering, and material-related reliability issues. Assess supplier manufacturing capabilities, including production capacity, process stability, equipment suitability, process windows, material control, and overall technical readiness for high-volume PCB fabrication (lamination, drilling, plating, etching, solder mask, surface finishes, impedance control, and automated optical/electrical testing).