Build and govern internal and external development programs with customers, universities, research organizations, government laboratories, suppliers, and startups, including technical scope, proposals and estimates, milestones, schedules, budgets, IP, and transition plans. Lead process integration, experiments, simulations, tape-outs, cryogenic characterization, technology transfer, qualification, and new-product introduction across superconducting logic, qubits, cryo-CMOS, multi-chip modules, TSVs, flip-chip, and heterogeneous integration.