Ideal candidate will have direct experience with one or more of the following types of Semiconductor Fabrication Equipment: Advanced Semiconductor Packaging, Fan Out Wafer Level Packaging, Hybrid Bonding, Photolithography, Wafer Bonding, Wet Etch, Metrology, Electroplate, PVD, CVD, Dry Etch, CMP, Advanced Packaging and Test equipment. We are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies.