Advanced Packaging Process Engineer, Silicon Technology (Starlink)

Spacex

  • Wausau, WI
  • 1 day ago
    Want to know if you’re a fit?
    Upload your resume and let our AI show you.

    Skills

    • Broadbandunmatched
    • Chemical Engineeringunmatched
    • Continuous Improvementunmatched
    • Cost Controlunmatched
    • Electrical Engineeringunmatched
    • Equipment Selectionunmatched
    • Flip Chipunmatched
    • Government Regulationsunmatched
    • Grindingunmatched
    • Manufacturingunmatched
    • Mass Productionunmatched
    • Material Scienceunmatched
    • Mechanical Engineeringunmatched
    • Molding Processesunmatched
    • Outsourcingunmatched
    • Package Layout Designunmatched
    • Physicsunmatched
    • Plating Processesunmatched
    • Printed Circuit Board (PCB)unmatched
    • Printed Circuit Board Assembly (PCBA)unmatched
    • Process Developmentunmatched
    • Process Engineeringunmatched
    • Product Packagingunmatched
    • Product/Service Launchunmatched
    • Prototypingunmatched
    • Receiversunmatched
    • Semiconductorsunmatched
    • Solderingunmatched
    • Surface Mount Technologyunmatched
    • Testingunmatched
    • United States Citizenunmatched

    Description

    SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.ADVANCED PACKAGING PROCESS ENGINEER, SILICON TECHNOLOGY (STARLINK)SpaceX is leveraging its experience building rockets and spacecraft to deploy Starlink, the world's most advanced broadband internet system. Starlink is the world's largest satellite constellation, providing fast, reliable internet to millions of users worldwide. We design, build, test, and operate all parts of the system – thousands of satellites, consumer receivers that allow users to connect within minutes of unboxing, and the software that brings it all together. We've only begun to scratch the surface of Starlink's potential global impact. As we continue to upgrade and expand the constellation, we're looking for best‑in‑class engineers to join the team.In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing advanced silicon packaging and assembly in-house for development and manufacturing. We are looking for hands‑on, dynamic engineers with expertise in semiconductor packaging design, process development, equipment, and testing. You will assume full ownership of packaging products and process modules and take them from concept to mass production as we strive to make Starlink more affordable to those who need it most.RESPONSIBILITIESOwn packaging assembly processes from concept to mass production, including equipment and material selection for wafer‑level and chip‑level systemsDevelop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, solder ball attach, and next‑generation panel‑level packaging processesBring‑up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging linesOwn packaging prototypes, product development, and release to productionSelect equipment and material to meet quality, reliability, cost, yield, and production targetsInterface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvementsCross‑functional interface with silicon design, materials, thermal, systems, and production teamsImplement advanced packaging solutions into SpaceX next generation products on Earth, in orbit, and beyondBASIC QUALIFICATIONSBachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other engineering discipline1+ years working with semiconductor packaging processing equipment, silicon, microelectronics, or packaging design (internship experience applicable)PREFERRED SKILLS AND EXPERIENCEAdvanced technical degree3+ years industry experience with microelectronics packaging developmentHands‑on packaging, PCB, PCBA, or SMT assembly experienceOSAT (outsource semiconductor assembly and test) experienceADDITIONAL REQUIREMENTSAbility to work extended hours or weekends as needed for mission critical deadlinesITAR REQUIREMENTSTo conform to U.S. Government export regulations, the applicant must be a U.S. citizen or national, U.S. lawful permanent resident (green card holder), refugee, or asylee, or be eligible to obtain the required authorizations from the U.S. Department of State.SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.Applicants wishing to view a copy of SpaceX's Affidavit Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to EEOCompliance@spacex.com.#J-18808-Ljbffr

    Numbers & Facts

    LocationWausau, WI

    Similar Jobs