ALD Thin Film Process Development Engineer

Texas Instruments' Advanced Technology Development team is looking for an energetic engineer with a passion for process development. This position provides the opportunity to enable new technologies for future Texas Instruments revenue growth. We are searching for a self-directed, highly motivated engineer to join our Lehi, UT Process Development team.

The responsibilities of a Process Development Engineer in this role include:

• Develop new processes and define processing and equipment requirements, specifications, and manufacturing methods for advanced semiconductor applications.
• Influence process integration schemes and support technology development from early paper studies and pilot work through full-scale manufacturing.
• Translate business unit roadmap requirements into pathfinding and process development projects.
• Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications
• Lead or support projects involving new process concepts, equipment selection, chemistry development, automation technologies, and novel manufacturing approaches.
• Provide technical engineering support in manufacturing and drive process and equipment modifications that improve production efficiency, technical capability, and yield.
• Develop and apply statistical methods, including Design of Experiments (DOE) and Statistical Process Control (SPC), to identify physical causes of yield loss and improve quality.
• Partner with equipment suppliers and vendors to define and execute equipment and process development roadmaps.
• Work across 300mm deposition platforms, including current single-wafer ALD and CVD systems.

Minimum requirements:

• Master's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
• 5+ years relevant experience in 300mm Advanced (
• Working knowledge of Process development, characterization and control of Thin films processing equipment, CVD, PE-CVD, Single-wafer ALD
• Strong supplier engagement skillset
• Strong foundation in statistical process control, Design of Experiments (DOE), data analysis, model-based problem solving, engineering change control, and process release strategies

Preferred qualifications:

• 5 years relevant experience in 300mm Advanced logic of advanced memory device technologies: Specific experience on RMG products
• Working knowledge of advanced CMOS device physics and reliability mechanisms
• Hands on Process Experience across multiple 300mm deposition platforms for dielectric, High-K and Metals
• Experience with Single-wafer ALD such as ASM XP4 Pulsar & XP8 platforms, as well as Batch ALD platforms
• Familiarity with 300mm Semiconductor Single wafer Thermal, RTA, Laser Anneal systems
• Direct R&D experience in 300mm semiconductors
• Experience with HKMG, Silicon Photonics
• Device physics training with understanding of materials, material evolution; structural characterization and electrical test characterization
• Data analysis skills
• Ability to work in teams and collaborate effectively with people in different functions and locations
• Strong relationship-building, communication, time management, and results-oriented collaboration skills to enable on-time project delivery

Minimum requirements:

• Master's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
• 5+ years relevant experience in 300mm Advanced (
• Working knowledge of Process development, characterization and control of Thin films processing equipment, CVD, PE-CVD, Single-wafer ALD
• Strong supplier engagement skillset
• Strong foundation in statistical process control, Design of Experiments (DOE), data analysis, model-based problem solving, engineering change control, and process release strategies

Preferred qualifications:

• 5 years relevant experience in 300mm Advanced logic of advanced memory device technologies: Specific experience on RMG products
• Working knowledge of advanced CMOS device physics and reliability mechanisms
• Hands on Process Experience across multiple 300mm deposition platforms for dielectric, High-K and Metals
• Experience with Single-wafer ALD such as ASM XP4 Pulsar & XP8 platforms, as well as Batch ALD platforms
• Familiarity with 300mm Semiconductor Single wafer Thermal, RTA, Laser Anneal systems
• Direct R&D experience in 300mm semiconductors
• Experience with HKMG, Silicon Photonics
• Device physics training with understanding of materials, material evolution; structural characterization and electrical test characterization
• Data analysis skills
• Ability to work in teams and collaborate effectively with people in different functions and locations
• Strong relationship-building, communication, time management, and results-oriented collaboration skills to enable on-time project delivery