Associate Quantum Hardware Assembly R&D Engineer

Key Responsibilities

As an Associate Quantum Hardware Assembly R&D Engineer, you will support the research, development, fabrication, and characterization of advanced electronic packaging technologies for quantum hardware.

Responsibilities include:

• Developing and optimizing assembly processes for next-generation quantum devices, including surface mount technology (SMT), die attach, flip-chip assembly, and related packaging techniques.
• Evaluating assembly yields, process capability, and package performance through electrical, mechanical, and physical characterization methods.
• Supporting hardware integration, process troubleshooting, and root-cause investigations to resolve assembly and packaging-related issues.
• Documenting experimental methods, results, and recommendations through technical reports, presentations, and formal documentation.
• Collaborating with multidisciplinary teams across IBM Quantum to support hardware development, integration, and technology maturation efforts.