Automatic Die Attach Operator 3 - 2nd Shift

MACOM Technology Solutions Holdings Inc
  • Nashua, NH
    4 days ago

    Job Description

    MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high-performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.

    MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers' success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.

    Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!

    Operator 3 - Datacon Auto Die Attach Operations

    Position Overview:

    The Assembler 3 - Datacon Auto Die Attach Operations supports semiconductor die attach production using automated Datacon equipment in accordance with documented manufacturing procedures. This role loads materials, monitors automated die attach processes, verifies process outputs, and completes production documentation while complying with quality, safety, ESD, and semiconductor manufacturing standards. The position does not include manual assembly, soldering, laser marking, or laser serialization. Work is performed under direct to moderate supervision, depending on experience level.

    Key Responsibilities:

    • Operate Datacon auto die attach equipment in accordance with drawings, travelers, work instructions, and process requirements.
    • Load and handle wafers, substrates, die, tools, and related materials using approved semiconductor handling practices.
    • Monitor automated die attach operations and verify placement accuracy, bond quality, alignment, and other process outputs using appropriate inspection tools.
    • Execute work in compliance with semiconductor manufacturing requirements, including ESD control, contamination awareness, and process discipline.
    • Identify and escalate equipment alarms, material issues, process deviations, or quality concerns to the appropriate lead, technician, or engineer.
    • Accurately record production data and complete electronic and paper-based documentation to support traceability requirements.
    • Maintain a safe, clean, and organized workspace in accordance with EHS and company policies.

    Key Competencies & Skills required:

    • Basic understanding of semiconductor manufacturing, die attach, or precision automated equipment concepts.
    • Ability to follow documented procedures, travelers, and verbal instructions.
    • Basic computer proficiency (data entry, navigating manufacturing systems).
    • Ability to operate Datacon auto die attach equipment after training.
    • Understanding of ESD fundamentals and clean handling practices.

    Required Qualifications and Experience:

    • High School diploma or equivalent.
    • Ability to read, understand, speak, and write English fluently to support safety, quality, and documentation requirements.
    • Ability to follow structured processes and work in a detail-oriented automated manufacturing environment.

    Physical & Work Environment:

    • Ability to perform repetitive tasks requiring careful material handling and attention to detail.
    • Requires use of microscopes, inspection tools, and computer-based manufacturing systems for extended periods.
    • Work will be performed in an ESD-controlled or clean manufacturing environment.

    EEO:

    MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.

    Reasonable Accommodation:

    MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process, please call +1-978-656-2500 or email HR_Ops@MACOM.com. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.

    Benefits: This position offers a comprehensive benefits package including but not limited to:

    • Health, dental, and vision insurance.
    • Employer-sponsored 401(k) plan.
    • Paid time off.
    • Professional development opportunities.

    Numbers & Facts

    LocationNashua, NH

    Skills

    • Aerospace and Defenseunmatched
    • Artificial Intelligence (AI)unmatched
    • Circuit Designunmatched
    • Computer Skillsunmatched
    • Corporate Policiesunmatched
    • Data Entryunmatched
    • Dental Insuranceunmatched
    • Detail Orientedunmatched
    • Documentationunmatched
    • English Languageunmatched
    • Leading Edge Technologyunmatched
    • Manufacturingunmatched
    • Manufacturing Requirementsunmatched
    • Manufacturing Systemsunmatched
    • Medical Equipmentunmatched
    • Microwavesunmatched
    • Network Administration/Managementunmatched
    • Network Operations Centerunmatched
    • Network Supportunmatched
    • Operational Supportunmatched
    • Organizational Skillsunmatched
    • Photonicsunmatched
    • Process Developmentunmatched
    • Product Packagingunmatched
    • Radio Frequencyunmatched
    • Record Keepingunmatched
    • Safety Complianceunmatched
    • Safety/Work Safetyunmatched
    • Satellite Communicationsunmatched
    • Semiconductor Manufacturingunmatched
    • Semiconductorsunmatched
    • Software Engineeringunmatched
    • Support Documentationunmatched
    • System Architectureunmatched
    • Technical Leadershipunmatched
    • Telecommunicationsunmatched
    • Test & Measurement Equipmentunmatched
    • Tool and Die Manufacturingunmatched
    • Traceabilityunmatched
    • Vehicle Drivingunmatched
    • Vision Planunmatched
    • Wafer Manufacturingunmatched
    • Wireless Communicationsunmatched

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