onsemi is seeking a Reliability Staff Engineer to join our team in Scottsdale, Arizona. You will be a key member of the cross-functional team responsible for delivering technology and products that exceed customer expectations for robustness, durability and reliability. This role plays a critical part in ensuring the robustness, durability, and lifetime performance of power semiconductor products. The successful candidate will provide technical leadership in reliability engineering with a strong focus on chip-package interactions, advanced power packaging, discrete devices, and power modules across silicon, silicon carbide (SiC), and gallium nitride (GaN) technologies.
This position requires deep understanding of electro‑thermo‑mechanical physics of failure, accelerated reliability testing, power cycling, and statistical analysis, as well as the ability to translate customer mission profiles into robust qualification strategies. The successful candidate will clearly convey complex reliability concepts, influence cross‑functional stakeholders, and engage directly with customers on product reliability performance. Expected to provide technical leadership in reliability, serving as a trusted advisor to internal stakeholders and customers on power semiconductor and packaging reliability.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
- PhD in Electrical Engineering, Materials Science, Mechanical Engineering, or related field; OR MS with 3-5 years of relevant experience.
- Strong understanding of physics of failure, particularly electro‑thermo‑mechanical mechanisms in semiconductor devices and packages.
- Proven experience with chip-package interactions, package materials, and assembly processes.
- Hands‑on experience with power cycling reliability testing and accelerated thermo‑mechanical stress.
- Experience with power semiconductor products (Si, SiC, GaN discrete devices and/or power modules).
- Proficiency with structured problem‑solving tools (FMEA, 8D, root cause analysis).
- Experience with statistical analysis tools (JMP, Minitab) and MS Office.
- Experience in extracting data, creating reports and dashboards using Power BI, Python, Oracle and/or SQL is a plus.
- Knowledge of industry reliability standards (JEDEC, AEC, IEC, MIL, AQG324) preferred.
- Experience working with automotive customers/OEMs is a plus.
- Willingness to travel (<10%).
- Excellent verbal and written communication skills in English.
The successful candidate will have to:
- Interface with Fab, Packaging, Product Engineering, Manufacturing, and Business Units.
- Define and own NPD reliability and robustness requirements for power semiconductor products.
- Lead reliability assessments for advanced power packaging technologies (e.g., sintered die attach, copper clip/ribbon, embedded die, power modules, double‑sided cooling).
- Analyze chip-package interaction effects and thermo‑mechanical failure mechanisms and propose design, process, or material improvements
- Influence package, device, and process design decisions through data‑driven reliability recommendations.
- Lead technical reliability discussions to align stakeholders on risk, tradeoffs, and qualification strategy.
- Design and execute power cycling, thermal cycling, and accelerated thermo‑mechanical stress tests.
- Develop, validate, and calibrate lifetime and acceleration models based on physics of failure and test data.
- Conduct early‑stage FMEA and drive RCCA for reliability stress failures.
- Collaborate with internal labs on reliability testing and failure analysis.
- Correlate accelerated stress results to customer mission profiles and application use conditions.
- Communicate complex reliability data, physics‑of‑failure insights, and risk assessments clearly to technical and non‑technical stakeholders.
- Manage multiple projects in a fast‑paced, cross‑functional environment.
The successful candidate will have to:
- Interface with Fab, Packaging, Product Engineering, Manufacturing, and Business Units.
- Define and own NPD reliability and robustness requirements for power semiconductor products.
- Lead reliability assessments for advanced power packaging technologies (e.g., sintered die attach, copper clip/ribbon, embedded die, power modules, double‑sided cooling).
- Analyze chip-package interaction effects and thermo‑mechanical failure mechanisms and propose design, process, or material improvements
- Influence package, device, and process design decisions through data‑driven reliability recommendations.
- Lead technical reliability discussions to align stakeholders on risk, tradeoffs, and qualification strategy.
- Design and execute power cycling, thermal cycling, and accelerated thermo‑mechanical stress tests.
- Develop, validate, and calibrate lifetime and acceleration models based on physics of failure and test data.
- Conduct early‑stage FMEA and drive RCCA for reliability stress failures.
- Collaborate with internal labs on reliability testing and failure analysis.
- Correlate accelerated stress results to customer mission profiles and application use conditions.
- Communicate complex reliability data, physics‑of‑failure insights, and risk assessments clearly to technical and non‑technical stakeholders.
- Manage multiple projects in a fast‑paced, cross‑functional environment.