Director – Advanced Packaging (Panel-Scale Technologies)

Overview:

ADVANCE YOUR CAREER. ADVANCE THE WORLD. 

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. 

 

Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.

Responsibilities:

The Role

We are seeking an advanced packaging technology leader to drive panel-scale packaging technology for next-generation data center and AI accelerator products. As a fabless company, AMD delivers packaging innovation through its ecosystem partners. In this role, you will set the panel-scale technology direction and lead through foundry, OSAT, substrate, materials, and equipment partners to define and deliver the materials, processes, design rules, and Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines that AMD products require.

You will own panel-scale technology readiness from concept through qualification and high-volume manufacturing, aligning partner roadmaps with AMD needs, holding partners accountable to technical and schedule commitments, and leading cross-functional AMD teams across geographies. You will communicate progress and risks to executive leadership and drive joint resolution of yield, reliability, and manufacturability challenges.

 

The Person

You have a proven track record of driving semiconductor technology development through external partners, ideally in advanced packaging for data center products. You lead through influence, building trusted, technically deep relationships with suppliers and foundries while setting clear requirements and driving execution. You are an excellent communicator who can convey complex technical findings and recommendations to partners, colleagues, and AMD executive leadership.

 

Key Responsibilities

• Define the panel-scale packaging technology roadmap for data center and AI products and align partner technology roadmaps to it.
• Lead panel-scale technology development with partners—including panel-level fan-out, large-format RDL(re-distribution layer) and interposers, and panel-scale die bonding—from concept through full qualification.
• Set technical requirements and guide partners in materials selection and process definition, ensuring solutions meet AMD performance, reliability, and cost targets.
• Work with partners to establish design rules and DFM/DFY guidelines, using jointly defined test vehicles to validate capability.
• Drive partner equipment and infrastructure readiness for panel-format manufacturing.
• Engage partners to resolve large-panel challenges including warpage, dimensional stability, overlay and alignment, and large-area uniformity.
• Establish yield and reliability targets, monitor partner data, and drive joint improvement plans through high-volume ramp.
• Lead cross-functional AMD teams across geographies and provide executive-level updates on partner progress, risks, and decisions.

Preferred Experience

• Semiconductor technology development.
• Leading technology development through foundries, OSATs, substrate suppliers, materials suppliers, and equipment vendors.
• Deep knowledge of 2.5D and 3D packaging, with experience in panel-level packaging or large-format substrates.
• Experience in wafer-level assembly processes such as fan-out, RDL fabrication, bumping, chip-on-wafer assembly, molding, temporary bonding/debonding, and wafer thinning.
• Experience with die bonding technologies, including mass reflow, thermocompression bonding (TCB), and hybrid bonding.
• Familiarity with emerging panel technologies such as glass-core substrates and panel-level RDL and interposers.
• Breadth of experience addressing thermo-mechanical, power delivery, and signal integrity challenges in large, high-power data center packages.
• Proven track record of qualifying new packaging technologies with partners for advanced data center products and ramping them to high-volume manufacturing.
• Leadership experience driving cross-functional teams and influencing external partners without direct authority.

Academic Credentials

BS/MS/PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Applied Physics, Applied Mathematics, or equivalent.

 

This role is not eligible for visa sponsorship.

 

#LI-AP1

Qualifications:

Benefits offered are described:  AMD benefits at a glance.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

 

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position.  AMD’s “Responsible AI Policy” is available here.

 

This posting is for an existing vacancy.