Hardware Electrical Rework Lab Technician

Join the Sensing Hardware team and you'll help us create a personal, physical connection for millions of customers around the world. Together, our team will enable our customers to do all the things they love with their Apple devices! Apple's Sensing, Power, and Haptics team, which supports hardware development across all product lines, is looking for a EE Rework Technician who will be responsible for for executing high-precision electrical rework, assembly, and modifications on complex R&D prototypes and test fixtures.

Beyond your exceptional technical soldering capabilities, you will be a cornerstone of our lab operations team. This role requires strong cross-functional collaboration and a team-oriented attitude. You will actively manage an incoming request pipelines, maintain specialized lab equipment, enforce safety protocols, and advise engineers and other lab users. If you are a self-motivated technical expert who thrives in a dynamic, high-impact environment, we want you on our team.High-Precision EE Rework: Autonomously conduct complex board-level reworks, PCB modifications, and manual assemblies for next-generation electronics prototypes and test fixtures in accordance with engineer-submitted schematics or diagrams. QC & Electrical Validation: Autonomously Perform hands-on quality control checks on all completed reworks. Use DMMs and other benchtop test equipment to verify electrical continuity, identify open/short circuits, measure component values, and validate that modified hardware functions as intended. Manage the Lab Intake Queue: Process, prioritize, and log incoming rework requests through our tracking system, ensuring high-quality, documented, and timely completion. Advise Engineers: Consult with engineers to identify optimal rework process and components to best enable research and robust hardware development. Lab Space Upkeep: Keep the rework lab spaces organized, clean, and stocked with necessary consumables (solder, fluxes, solder-wick, components, tools, etc.). Maintain Health & Safety: Actively enforce EH&S compliance and SOPs across the EE rework lab spaces. Drive Tech Transfer & Improvement: Work closely with the lab management team to identify process gaps, propose lab workflow optimizations, and transfer successful rework/test methodologies across organization boundaries.8+ year minimum related experience required in high-precision electronic circuit board manual assembly and rework in an R&D lab, hardware development, or production-support setting. Proven ability to hand-solder and rework BGA, LGA, QFN IC modules, and passives down to 01005 size under a microscope, including mounting ultra-fine jumper wires, installing micro-coax cables, and manually cutting/modifying delicate PCB traces. Expert-level operation of rework equipment (soldering irons, hot air guns, hot plates, reflow/rework stations) paired with proficiency in benchtop EE test equipment (DMMs, DC power supplies, etc.) to verify and troubleshoot rework for functional integrity; functional fluency reading circuit diagrams and PCB layouts. Experience using digital job submission/tracking systems to intake, prioritize, and document engineering requests, along with strong interpersonal and communication skills to manage engineer expectations and explain technical tradeoffs. Uncompromising commitment to lab safety and housekeeping, familiarity with basic chemical hazards (solvents, fluxes, epoxy), and physical capability to work in a lab environment, including lifting up to 20 lbs. Proficiency with digital productivity tools (spreadsheets, presentations, workflow management) and a willingness to learn new skills.Navigate ECAD software (Allegro/Altium/KiCad/etc.) to examine board design files (layout/ODB++), Experience operating and interpreting 2D/3D X-Ray equipment to inspect BGA/LGA solder joints for voiding and assembly defects. Experience operating automated/semi-automated rework stations for BGA re-balling and SMD placement such an Ersa HR550 or similar. Experience operating wire bonding equipment (wedge and/or ball bonding), with any level of automation, for microelectronic assemblies. Experience with running characterization and FA measurements such at TDR, DK, utilizing a probe station when necessary.