Mechanical FEA Engineer - Electronics and PCBA

Ttile:Mechanical FEA Engineer Electronics and PCBA
Location: Fremont, California, USA
Experience: 5+ Years
Work Arrangement: Onsite

Job Summary

Innova Software Services Inc. is seeking an experienced Mechanical FEA Engineer to support mechanical simulation, structural analysis, and reliability evaluation of advanced electronic hardware and accelerator modules.

The ideal candidate will have strong hands-on experience with Ansys, Altair/HyperMesh, PCB/PCBA warpage simulation, structural FEA, shock and vibration analysis, modal analysis, and simulation-to-test correlation.

This position requires the ability to develop accurate finite element models, evaluate mechanical and thermal deformation, identify reliability risks, and communicate analysis findings against defined engineering acceptance criteria.

Key Responsibilities

Structural FEA and Mechanical Design

• Perform static structural finite element analysis for mechanical stiffener design iterations.

• Evaluate rib layouts, thickness, geometry, mounting locations, and material selections.

• Analyze mounting pressure, gravity sag, and handling load cases.

• Assess structural deformation, stress distribution, and yield risks.

Shock, Vibration and Fatigue Analysis

• Perform random vibration, sine sweep, and shock analyses for transportation and operational conditions.

• Conduct modal analysis and verify modal separation.

• Evaluate fatigue and structural yield risks.

• Support simulation of mechanical shock and drop events.

PCB and PCBA Warpage Simulation

• Perform staged warpage simulations for bare PCBs, populated components, and complete PCBAs.

• Analyze room-temperature and elevated-temperature conditions.

• Evaluate coefficient of thermal expansion (CTE) mismatch and assembly-related deformation.

• Assess reflow and manufacturing effects on PCB/PCBA warpage.

• Identify surface-mount technology (SMT) reliability risks using package warpage contours.

Simulation Validation and Test Correlation

• Correlate FEA results with shadow-moir measurements, shaker testing, and drop-test data.

• Refine simulation models based on measured results.

• Evaluate simulation accuracy and identify deviations.

• Support model validation and engineering recommendations.

Engineering Documentation

• Develop analysis plans and finite element models.

• Prepare meshed models, result fields, stress plots, and warpage contours.

• Document analysis assumptions, load cases, and boundary conditions.

• Deliver technical reports with pass/fail evaluations against defined acceptance criteria.

• Communicate simulation findings and design recommendations to engineering teams.

Required Qualifications

• 5+ years of professional experience in structural finite element analysis involving electronics, PCBAs, or semiconductor packaging.

• Hands-on experience using Ansys and/or Altair/HyperMesh.

• Strong experience with PCB/PCBA warpage simulation.

• Knowledge of CTE mismatch, reflow effects, and temperature-dependent mechanical deformation.

• Experience with static structural analysis, modal analysis, shock, vibration, and fatigue evaluation.

• Experience correlating simulation models with physical test results.

• Ability to refine FEA models based on measured data.

• Experience developing analysis reports and evaluating results against acceptance criteria.

• Strong analytical, problem-solving, documentation, and communication skills.

Preferred Qualifications

• Experience with mechanical simulation of electronic accelerator modules.

• Experience with PCB stiffener design and structural optimization.

• Familiarity with shadow-moir testing and warpage measurements.

• Experience with shaker testing and drop-test correlation.

• Knowledge of SMT assembly reliability and semiconductor packaging.

• Experience analyzing complex electronic hardware assemblies.

Key Technical Skills

Mechanical FEA | Structural Analysis | Ansys | Altair | HyperMesh | PCB | PCBA | Warpage Simulation | CTE Mismatch | Shock Analysis | Random Vibration | Sine Sweep | Modal Analysis | Fatigue Analysis | Stiffener Design | Shadow-Moir | Drop Testing | SMT Reliability | Electronics Packaging