About the Role
Join our Advanced Packaging Technology and Manufacturing team as a Module Development Engineer, Defect Inspection, where you will help enable next-generation semiconductor innovation. In this role, you will develop, optimize, and scale defect inspection solutions that support both current high-volume manufacturing (HVM) and future technology nodes.
You will collaborate across engineering, suppliers, and research teams to improve inspection capability, drive yield improvements, and influence future process technologies.
What You’ll Do
Key responsibilities will include but not limited to:
Behavioral traits that we are looking for candidates who:
Why Join Us
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Note:
For information on Intel’s immigration sponsorship guidelines, please see
Intel U.S. Immigration Sponsorship Information
Minimum Qualifications and Experience:
Bachelor’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or related field + 4 years of experience. Or a Master's degree in the same field with 3+ years of experience and a PhD in the same field with 2+ years of experience.
Your experience described above must be in the following:
Preferred Qualifications and Experience:
We invite you to bring your expertise and creativity to Intel, where you will have the opportunity to innovate, collaborate, and shape the future of semiconductor technology. Apply now and become an integral part of our dynamic team.
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| Location | Portland, OR |
| Salary | $127,400–$179,900 Per Year |
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