NewProcess Integration Engineer INTELProcess Integration EngineerVernonia, OR$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewModule Development Engineer INTELModule Development EngineerSanta Clara, CA$172,200–$243,000 / yearRemains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
NewPackaging Engineer INTELPackaging EngineerPhoenix, AZ$116,100–$163,800 / yearDuring factory ramps, owns equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes). Job Responsibilities: Strong understanding of TEL CLEAN TRACK / LITHIUS Pro V coat-develop track operation, including wafer flow, FOUP handling, transfer robotics, spin coat, develop, bake, chill, HMDS, EBR, backside rinse, and dispense modules.
NewModule Development Engineer INTELModule Development EngineerPortland, OR$201,330–$284,230 / yearDeep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.
NewProcess Engineer - RF Test INTELProcess Engineer - RF TestPortland, OR$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewProcess Integration Engineer INTELProcess Integration EngineerLafayette, OR$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewPackaging Engineer INTELPackaging EngineerPhoenix, AZ$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewProcess Engineer - RF Test INTELProcess Engineer - RF TestLafayette, OR$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewProcess Engineer - RF Test INTELProcess Engineer - RF TestVernonia, OR$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewProcess Engineer - RF Test INTELProcess Engineer - RF TestPhoenix, AZ$116,100–$163,800 / yearBSE degree in Electrical Engineering, Microelectronics Engineering, Material Science Engineering, Chemical Engineering, Mechanical Engineering, Optical Engineering, Statistics/Data Science, Chemistry, Physics or related field of study with 4+ years of experience, or Master’s degree with 3+ years of experience or a Ph. The role of a Process Integration and Yield Engineer is to deliver high quality analytical insights that influences / directs the factory resources to minimize defects, control process parameters, and improve overall factory yields.
NewModule Development Engineer INTELModule Development EngineerPhoenix, AZ$201,330–$284,230 / yearDeep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.
NewPackaging Engineer INTELPackaging EngineerPhoenix, AZ$116,100–$163,800 / yearBSE degree in Electrical Engineering, Microelectronics Engineering, Material Science Engineering, Chemical Engineering, Mechanical Engineering, Optical Engineering, Statistics/Data Science, Chemistry, Physics or related field of study with 4+ years of experience, or Master’s degree with 3+ years of experience or a Ph. The role of a Process Integration and Yield Engineer is to deliver high quality analytical insights that influences / directs the factory resources to minimize defects, control process parameters, and improve overall factory yields.
NewSeniconductor Process Engineer INTELSeniconductor Process EngineerPhoenix, AZ$127,400–$179,900 / yearMaster's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field. The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.
NewModule Development Engineer INTELModule Development EngineerHillsboro, OR$172,200–$243,000 / yearRemains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
NewYield Engineer INTELYield EngineerPhoenix, AZ$85,800–$121,100 / yearWe provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs and amenities, time off, recreational activities, discounts on various products and services, and much more creative perks that make Intel a Great Place to Work. See Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions.
NewProcess Integration Engineer INTELProcess Integration EngineerPhoenix, AZ$85,800–$121,100 / yearWe provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs and amenities, time off, recreational activities, discounts on various products and services, and much more creative perks that make Intel a Great Place to Work. See Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions.
NewModule Development Engineer INTELModule Development EngineerVernonia, OR$172,200–$243,000 / yearRemains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
NewPackaging Engineer INTELPackaging EngineerPhoenix, AZ$85,800–$121,100 / yearWe provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs and amenities, time off, recreational activities, discounts on various products and services, and much more creative perks that make Intel a Great Place to Work. See Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions.
NewYield Engineer INTELYield EngineerPhoenix, AZ$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewProcess Engineer - RF Test INTELProcess Engineer - RF TestPhoenix, AZ$127,400–$179,900 / yearMaster's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field. The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.
NewYield Engineer INTELYield EngineerPhoenix, AZ$116,100–$163,800 / yearBSE degree in Electrical Engineering, Microelectronics Engineering, Material Science Engineering, Chemical Engineering, Mechanical Engineering, Optical Engineering, Statistics/Data Science, Chemistry, Physics or related field of study with 4+ years of experience, or Master’s degree with 3+ years of experience or a Ph. The role of a Process Integration and Yield Engineer is to deliver high quality analytical insights that influences / directs the factory resources to minimize defects, control process parameters, and improve overall factory yields.
NewPackaging Module Development Engineer INTELPackaging Module Development EngineerPhoenix, AZ$148,100–$209,100 / yearThis position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design, technology integration, reliability, yield and manufacturing. See Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions.
NewProcess Integration Engineer INTELProcess Integration EngineerPhoenix, AZ$116,100–$163,800 / yearDuring factory ramps, owns equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes). Job Responsibilities: Strong understanding of TEL CLEAN TRACK / LITHIUS Pro V coat-develop track operation, including wafer flow, FOUP handling, transfer robotics, spin coat, develop, bake, chill, HMDS, EBR, backside rinse, and dispense modules.
NewPackaging Engineer INTELPackaging EngineerHillsboro, OR$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewYield Development Engineering Manager-Strategic Programs INTELYield Development Engineering Manager-Strategic ProgramsLafayette, OR$252,840–$356,950 / yearAs a key member of the technology and manufacturing leadership team, you will define long-term strategy, influence roadmaps across process integration and metrology, and drive execution of complex, high-impact programs that position the organization for future technology nodes and advanced packaging innovations. Minimum Qualifications • Bachelor's degree in Engineering, Physics, Materials Science, Data Science, or related field (advanced degree preferred).• 12+ years of experience in semiconductor manufacturing with deep expertise in yield engineering, defect metrology, or process integration.•
NewProcess Integration Engineer INTELProcess Integration EngineerPhoenix, AZ$127,400–$179,900 / yearMaster's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field. The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.
NewYield Engineer INTELYield EngineerHillsboro, OR$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewModule Development Engineer INTELModule Development EngineerAustin, TX$201,330–$284,230 / yearDeep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.
NewYield Engineer INTELYield EngineerPhoenix, AZ$127,400–$179,900 / yearMaster's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field. The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.
NewProcess Integration Engineer INTELProcess Integration EngineerPhoenix, AZ$116,100–$163,800 / yearBSE degree in Electrical Engineering, Microelectronics Engineering, Material Science Engineering, Chemical Engineering, Mechanical Engineering, Optical Engineering, Statistics/Data Science, Chemistry, Physics or related field of study with 4+ years of experience, or Master’s degree with 3+ years of experience or a Ph. The role of a Process Integration and Yield Engineer is to deliver high quality analytical insights that influences / directs the factory resources to minimize defects, control process parameters, and improve overall factory yields.
NewProcess Integration Engineer INTELProcess Integration EngineerHillsboro, OR$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewModule Development Engineer INTELModule Development EngineerLafayette, OR$201,330–$284,230 / yearDeep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.
NewSeniconductor Process Engineer INTELSeniconductor Process EngineerPhoenix, AZ$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewModule Development Engineer INTELModule Development EngineerPhoenix, AZ$172,200–$243,000 / yearRemains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
NewPackaging Module Development Engineer INTELPackaging Module Development EngineerPhoenix, AZ$127,400–$179,900 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. Master's degree with 3 or more years, or PhD degree with 0 years of experience in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related technical field.
NewModule Development Engineer INTELModule Development EngineerLafayette, OR$172,200–$243,000 / yearRemains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
NewPackaging Engineer INTELPackaging EngineerVernonia, OR$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewYield Engineer INTELYield EngineerPortland, OR$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewProcess Engineer - RF Test INTELProcess Engineer - RF TestHillsboro, OR$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewModule Development Engineer INTELModule Development EngineerPortland, OR$172,200–$243,000 / yearRemains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
NewPackaging Engineer INTELPackaging EngineerLafayette, OR$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewProcess Engineer - RF Test INTELProcess Engineer - RF TestPhoenix, AZ$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewSeniconductor Process Engineer INTELSeniconductor Process EngineerPhoenix, AZ$85,800–$121,100 / yearWe provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs and amenities, time off, recreational activities, discounts on various products and services, and much more creative perks that make Intel a Great Place to Work. See Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions.
NewPackaging Module Development Engineer INTELPackaging Module Development EngineerPhoenix, AZ$127,400–$179,900 / yearThe Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. See Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions.
NewSeniconductor Process Engineer INTELSeniconductor Process EngineerPortland, OR$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewYield Development Engineering Manager-Strategic Programs INTELYield Development Engineering Manager-Strategic ProgramsPortland, OR$252,840–$356,950 / yearAs a key member of the technology and manufacturing leadership team, you will define long-term strategy, influence roadmaps across process integration and metrology, and drive execution of complex, high-impact programs that position the organization for future technology nodes and advanced packaging innovations. Minimum Qualifications • Bachelor's degree in Engineering, Physics, Materials Science, Data Science, or related field (advanced degree preferred).• 12+ years of experience in semiconductor manufacturing with deep expertise in yield engineering, defect metrology, or process integration.•
NewYield Engineer INTELYield EngineerLafayette, OR$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewProcess Engineer - RF Test INTELProcess Engineer - RF TestPhoenix, AZ$116,100–$163,800 / yearDuring factory ramps, owns equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes). Job Responsibilities: Strong understanding of TEL CLEAN TRACK / LITHIUS Pro V coat-develop track operation, including wafer flow, FOUP handling, transfer robotics, spin coat, develop, bake, chill, HMDS, EBR, backside rinse, and dispense modules.
NewProcess Integration Engineer INTELProcess Integration EngineerPortland, OR$148,100–$209,100 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products.
NewProcess Engineer - RF Test INTELProcess Engineer - RF TestPhoenix, AZ$85,800–$121,100 / yearWe provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs and amenities, time off, recreational activities, discounts on various products and services, and much more creative perks that make Intel a Great Place to Work. See Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions.