Note: This role requires regular onsite presence to perform essential job responsibilities.

This position drives technology development and enablement for both high-volume manufacturing and future process technologies. Responsibilities include providing process integration and equipment solutions, conducting feasibility studies to meet device performance requirements, and leading the design and development of advanced manufacturing processes. The role involves material selection, parameter optimization, metrology, equipment engineering, and system design to enable new product architectures and functional requirements.

The successful candidate will lead pathfinding activities that support process and hardware development for next-generation manufacturing technologies and will contribute to technology roadmaps that enable future product innovation. The role also includes identifying and implementing equipment and process improvements to enhance manufacturing efficiency, optimize production output, and improve operational performance.

Minimum Qualifications

• Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with 6+ years of semiconductor industry experience, primarily in dry etch process development.
• Bachelor's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with 9+ years of semiconductor industry experience, primarily in dry etch process development.
• 3+ years of experience collaborating with equipment suppliers (e.g., Lam Research, TEL, Applied Materials, Hitachi) on process optimization, development, and implementation.

Preferred Qualifications

• Ph.D. in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with research publications and/or a patent portfolio focused on dry etch technologies, and 5+ years of semiconductor industry experience, primarily in dry etch process development.
• 5+ years of experience in TSV (Through-Silicon Via) etch process development.
• Proven track record in process development, manufacturing engineering, and technical leadership.
• Experience supporting semiconductor fab startups across manufacturing, quality, R&D, and supply chain functions.
• Experience with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems.
• Demonstrated success delivering customized process and technology solutions across Technology Development and High-Volume Manufacturing (HVM) organizations.
• Strong cross-functional leadership skills with experience managing diverse stakeholder groups.
• Experience working in a semiconductor foundry environment.