Package Design Engineer - Signal and Power Integrity

North Reading, MA

$53–$85 Per Hour
Instant Apply

30+ days ago

Job Description

Job Title: Package Design Engineer - Signal and Power Integrity
Location: North Reading, MA (100% onsite)
Duration: 12-month (Temp to Hire)
Payrate: $53 to $85 per hour

Responsibilities:

This role contributes to the physical realization of complex RF, analog, digital, and mixed-signal ASIC products across the chip, package, board, socket, fixture, and system interconnect environment.
Working under limited direction and in collaboration with experienced package, SI/PI, thermal, mechanical, ASIC, PCB, manufacturing, and supplier teams, the Package Design Engineer will independently develop analysis approaches for assigned work, provide practical solutions to difficult package design problems, and contribute to design decisions whose accuracy can materially affect project cost and schedule.
Support ASIC package signal and power integrity development, including package stackup evaluation, bump and BGA escape planning, return-path control, power-delivery partitioning, and package-to-board co-design.
Develop and review package and PCB layout constraints for high-speed serial links, clocks, DUT I/O, power rails, and sensitive analog or mixed-signal interfaces while balancing electrical performance, manufacturability, reliability, cost, and schedule.
Apply electromagnetic and transmission-line principles to evaluate package, board, socket, connector, interposer, and fixture interconnects in the time and frequency domains.
Build, review, and document simulation models for insertion loss, return loss, crosstalk, mode conversion, skew, impedance discontinuities, resonances, eye behavior, and power-distribution performance.
Support package-level power-distribution-network analysis, including target impedance, decoupling strategy, DC IR drop, current density, transient droop or noise, and plane or cavity resonance.
Participate in thermal and mechanical co-design reviews addressing heat-flow paths, material and stackup choices, thermal-interface materials, package warpage and coplanarity, CTE interaction, stress, attachment methods, and package-to-board interfaces.
Collaborate with ASIC design, PCB design, thermal, mechanical, test, characterization, manufacturing, procurement, quality, EDA tool teams, and external package and PCB suppliers to identify and close assigned technical risks.
Contribute to design-for-manufacture and design-for-assembly reviews for package substrates and PCBs.
Plan and support simulation-to-hardware correlation using S-parameters, VNA, TDR/TDT, high-speed oscilloscopes, probes, fixtures, and coupon structures under guidance from senior engineers.
Prepare clear design-review materials, analysis summaries, requirements, constraints, model documentation, and action-item closure evidence.

Must Have:

Bachelor of Science in Electrical Engineering (BSEE) or a closely related electrical engineering discipline required.
Two or more years of relevant engineering experience in semiconductor packaging, high-speed digital or mixed-signal hardware, signal integrity, power integrity, PCB design, package design, modeling, validation, or a related field.
Working knowledge of electromagnetic field and transmission-line fundamentals, impedance control, reflections, crosstalk, return paths, high-speed signaling, and power-distribution concepts.
Experience or coursework using time-domain and frequency-domain analysis methods, S-parameters, circuit simulation, or electromagnetic field solvers.
Familiarity with package and PCB design concepts, fabrication, assembly, and design-for-manufacture considerations.
Experience with Cadence tools preferred; experience with Ansys, HyperLynx, ADS, HFSS, SPICE, or comparable tools is also relevant.
Familiarity with IBIS, IBIS-AMI, or SPICE-class models preferred.
Experience using laboratory equipment such as a VNA, TDR/TDT, or high-speed oscilloscope preferred.
Strong analytical, diagnostic, organizational, written communication, and presentation skills.
Programming or automation experience with Python, Tcl, MATLAB, Perl, C/C++, C#, Visual Basic, or similar tools is preferred.

Numbers & Facts

Location	North Reading, MA
Salary	$53–$85 Per Hour

Skills

ASIC (Application Specific Integrated Circuit)unmatched
ASIC Designunmatched
Analysis Skillsunmatched
Automationunmatched
Ball Grid Array (BGA)unmatched
C Programming Languageunmatched
C++ Programming Languageunmatched
Cadenceunmatched
Circuit Simulationunmatched
Communication Skillsunmatched
Crosstalkunmatched
Design for Assembly (DFA)unmatched
Documentation Modelsunmatched
Electrical Engineeringunmatched
Electricityunmatched
Electromagnetismunmatched
Engineeringunmatched
HFSS (High Frequency Structure Simulator)unmatched
IR (Infrared)unmatched
Input/Outputunmatched
Laboratoryunmatched
Laboratory Equipmentunmatched
MATLABunmatched
Manufacturingunmatched
Materials Analysisunmatched
Mechanical Designunmatched
Mechanical Testingunmatched
Microsoft C# (C Sharp)unmatched
Microsoft Visual Basicunmatched
Model Validationunmatched
Network Performance/Analysisunmatched
Oscilloscopeunmatched
PCB (Printed Circuit Board) Manufacturingunmatched
Perl Programming Languageunmatched
Presentation/Verbal Skillsunmatched
Printed Circuit Board (PCB)unmatched
Printed Circuit Board (PCB) Layoutunmatched
Printed Circuit Board Designunmatched
Project Scheduleunmatched
Purchasing/Procurementunmatched
Python Programming/Scripting Languageunmatched
Radio Frequencyunmatched
Requirements Managementunmatched
SPICE (Simulation Program with Integrated Circuit Emphasis)unmatched
Semiconductorsunmatched
Serial Link Circuitsunmatched
Signal Integrityunmatched
Simulationunmatched
Socketsunmatched
System Integration (SI)unmatched
Tcl-Tkunmatched
Technical/Engineering Designunmatched
Vendor/Supplier Selectionunmatched
Writing Skillsunmatched

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