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Package Engineer, Annapurna Labs - AI Silicon Packaging

Amazon.com Inc
  • Austin, TX
    4 days ago

    Job Description

    Annapurna Labs designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.

    The Package Technology Development team within Annapurna Labs is building the packaging, substrate/PCB, interposer, and assembly technologies for the next-generation Trainium AI accelerators. The team works at the intersection of silicon, package, board, system, and rack, partnering closely with design, manufacturing, supply chain, and reliability teams to bring bleeding-edge AI systems from concept to volume production.

    Key job responsibilities

    • Define and drive package technology development across architecture, design, materials, processes, yield, warpage, reliability, and system-level integration for next-generation Trainium systems, from early concept through volume production.
    • Partner with OSATs and component/material/equipment suppliers on capability validation, test vehicle development, qualification, TGA, FMEA, risk retirement, root-cause analysis, and corrective/preventive actions
    • Evaluate tradeoffs across performance, cost, yield, manufacturability, warpage, thermal performance, and reliability to guide technology decisions and qualification strategies.
    • Represent the package technology team in cross-functional design reviews, sign-off milestones, and program checkpoints with silicon, board, system, and supply chain teams.
    • Identify opportunities for novel packaging architectures and process simplifications to reduce cost, improve yield, and accelerate time-to-market.

    Numbers & Facts

    LocationAustin, TX
    IndustryRetail
    Company Size10,000 employees or more
    Year Founded1994
    Websitehttp://Amazon.com/militaryroles

    About Company

    At Amazon, we don’t wait for the next big idea to present itself. We envision the shape of impossible things and then we boldly make them reality. So far, this mindset has helped us achieve some incredible things. Let’s build new systems, challenge the status quo, and design the world we want to live in. We believe the work you do here will be the best work of your life.

    Wherever you are in your career exploration, Amazon likely has an opportunity for you. Our research scientists and engineers shape the future of natural language understanding with Alexa. Fulfillment center associates around the globe send customer orders from our warehouses to doorsteps. Product managers set feature requirements, strategy, and marketing messages for brand new customer experiences. And as we grow, we’ll add jobs that haven’t been invented yet.

    It’s Always Day 1
    At Amazon, it’s always “Day 1.” Now, what does this mean and why does it matter? It means that our approach remains the same as it was on Amazon’s very first day – to make smart, fast decisions, stay nimble, invent, and stay focused on delighting our customers. In our 2016 shareholder letter, Amazon CEO Jeff Bezos shared his thoughts on how to keep up a Day 1 company mindset. “Staying in Day 1 requires you to experiment patiently, accept failures, plant seeds, protect saplings, and double down when you see customer delight,” he wrote. “A customer-obsessed culture best creates the conditions where all of that can happen.” You can read the full letter here

    Our Leadership Principles
    Our Leadership Principles help us keep a Day 1 mentality. They aren’t just a pretty inspirational wall hanging. Amazonians use them, every day, whether they’re discussing ideas for new projects, deciding on the best solution for a customer’s problem, or interviewing candidates. To read through our Leadership Principles from Customer Obsession to Bias for Action, visit https://www.amazon.jobs/principles

    Skills

    • Architectural Designunmatched
    • Artificial Intelligence (AI)unmatched
    • Assemblers Technologyunmatched
    • Cloud Computingunmatched
    • Corrective Actionunmatched
    • Cost Controlunmatched
    • Cross-Functionalunmatched
    • Customer Support/Serviceunmatched
    • Failure Mode and Effects Analysis (FMEA)unmatched
    • Manufacturingunmatched
    • Printed Circuit Board (PCB)unmatched
    • Production Volumeunmatched
    • Productivity Managementunmatched
    • Riskunmatched
    • Root Cause Analysisunmatched
    • Software Designunmatched
    • Supply Chainunmatched
    • System Integration (SI)unmatched
    • Systems Reliabilityunmatched
    • Technical/Engineering Designunmatched
    • Test Plan/Scheduleunmatched
    • Trade-Off Analysisunmatched
    • Validation Testingunmatched

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