Packaging Engineering Intern MS/PhD

Change the world. Love your job.

Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI''s analog and embedded processing products. Assignments may include participation in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness. Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization. TI''s innovative packaging technologies are designed to solve customers'' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.

Put your talent to work with us as a Packaging Engineering Intern !

Why TI?

• Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
• We''re different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
• Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws.

If you are interested in this position, please apply to this requisition.

Minimum Requirements:

• Currently pursuing a Masters degree in Mechanical Engineering, Materials Science, Chemical Engineering, Optical Science, Electrical Engineering or related.
• Cumulative 3.0/4.0 GPA or higher

Preferred Qualifications:

• Coursework or research in semiconductor packaging/fabrication
• Experience with AutoCAD design and FEM modeling
• Strong fundamentals in heat transfer, thermodynamics, and stress analysis
• Experience with Semiconductor MEMS/3D integration design and fabrication
• Project experience in the areas of: CVD, PVD, thin film deposition, electroplating, plasma etch, ML based package design, wafer bumping, or optical packaging
• Experience with plating, adhesion, surface treatment process
• Hands experience with semiconductor fabrication and characterization tools including VI Scopes, X-ray Inspection, materials characterization, and FA techniques
• Strong written and verbal communication skills
• Demonstrated analytical and problem solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for results