Principal PCB Layout Designer (PADS) US CITIZEN ONLY

Principal PCB Layout Designer (PADS) position in Cincinnati, OH. REMOTE WORK

US Citizenship required for this position

Security Clearance IS NOT REQUIRED

Weekdays with every other Friday off (9/80 work schedule)

REMOTE WORK

Job Description:

We are seeking a Principal PCB Layout Designer using PADS based out of Cincinnati, OH.

As a Principal PCB Layout Design Engineer at Northrop Grumman, you will have a challenging and rewarding opportunity to support the design and delivery of high reliability circuit card assemblies for aerospace, defense, and space flight applications.

You will collaborate across electrical, mechanical, manufacturing, and signal integrity disciplines to transform complex electrical architectures and schematics into robust, production ready printed circuit board solutions.

The successful candidate will be collaborative, open, and team oriented, with a focus on shared responsibility, continuous learning, and a culture of innovation and technical excellence.

For this role, responsibilities include but are not limited to:

Execute the placement and routing of complex, high density, multi-layer printed circuit boards (PCBs), including high speed digital, RF, mixed signal, and power circuits

Interpret electrical schematics, constraints, and mechanical boundaries to develop optimized PCB layouts that meet performance, reliability, and manufacturability requirements

Generate and maintain complete PCB and circuit card assembly (CCA) fabrication and assembly documentation packages, including artwork, drawings, fabrication notes, and data outputs for procurement and assembly partners

Apply current IPC and high reliability industry standards, as well as applicable military and aerospace criteria, in the design and verification of printed wiring boards and circuit card assemblies

Collaborate closely with electrical, mechanical, manufacturing, and signal integrity engineers to address layout related design challenges involving signal integrity, power integrity, thermal management, and packaging

Support and perform Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Test (DFT) reviews using automated and manual checks to improve yield, test coverage, and product robustness

Work with fabrication and assembly suppliers to understand manufacturing capabilities and constraints and incorporate them into PCB designs

Support PCB library management practices, ensuring correct use of symbols, footprints, and parameter data in accordance with internal workflows

Independently own PCB layout tasks from concept through fabrication data release in support of program cost, schedule, and technical requirements

Lead advanced PCB layout efforts using technologies such as High Density Interconnect (HDI), microvias, via in pad, backdrilling, and specialized substrate materials; provide technical guidance, peer reviews, and mentoring to other layout designers

TECHNICAL SKILLS

Must Have

5 Years with Bachelors in Science; 3 Years with Masters; 1 Year with PhD

Excellent organizational and problem solving skills with a demonstrated ability to adapt effectively to changing requirements

Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity

Experience generating artwork and PCB/CCA documentation for procurement and assembly houses

Experience with the layout of PCBs and circuit card assemblies, including placement and routing of high speed digital, RF, and/or mixed signal circuits

Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high reliability criteria

Minimum 5 years of experience performing engineering/layout of printed circuit boards using PADS

Willingness and ability to work on site full time at the Cincinnati, OH location

Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations

Nice To Have

Ability to translate complex mechanical boundaries and electrical constraints into optimized physical PCB layouts across multiple boards or modules

Demonstrated experience in the layout of advanced, high density, multi-layer printed circuit boards combining RF, high speed digital, and high power circuit sections

Knowledge of high reliability military and aerospace hardware criteria (e.g., MIL PRF 31032, MIL STD 883, IPC Class 3/3A), or comparable experience demonstrating equivalent rigor

Knowledge of PCB process workflows and library management, including creation and governance of symbols, footprints, and reusable layout elements

Prior experience on defense or space flight programs with stringent reliability, documentation, and traceability requirements

Experience

3 - 5 years

Basic Qualifications:

5 Years with Bachelors in Science; 3 Years with Masters; 1 Year with PhD

Willingness and ability to work on site full time at the Cincinnati, OH location

Minimum 5 years of experience performing engineering/layout of printed circuit boards using PADS

Experience with the layout of PCBs and circuit card assemblies, including placement and routing of high speed digital, RF, and/or mixed signal circuits

Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity

Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations

Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high reliability criteria

Experience generating artwork and PCB/CCA documentation for procurement and assembly houses

Excellent organizational and problem solving skills with a demonstrated ability to adapt effectively to changing requirements

Preferred Qualifications

Prior experience on defense or space flight programs with stringent reliability, documentation, and traceability requirements

Demonstrated experience in the layout of advanced, high density, multi-layer printed circuit boards combining RF, high speed digital, and high power circuit sections

Knowledge of PCB process workflows and library management, including creation and governance of symbols, footprints, and reusable layout elements

Ability to translate complex mechanical boundaries and electrical constraints into optimized physical PCB layouts across multiple boards or modules

Knowledge of high reliability military and aerospace hardware criteria (e.g., MIL PRF 31032, MIL STD 883, IPC Class 3/3A), or comparable experience demonstrating equivalent rigor

Security Clearance Required?

No

Join Northrop Grumman Cincinnati (aka Xetron), part of Mission Systems sector, focused on the development of new capabilities for our military and intelligence customers around the globe. Our Northrop Grumman Cincinnati, Ohio small business culture operates collaboratively within a larger corporation providing the benefits of both. This unique relationship offers employees the ability to know everyone at the site while working on technologies and products that are beyond state-of-the-art. You and your team will wrestle with the next big problems in an atmosphere of collaboration and cooperation, sharing your expertise while learning from the expert next to you. Remember when you were excited about getting to work because of the challenge of the problem, the importance of the solution and the fun you had with your team? It's that kind of place! But don't take my word for it, see for yourself! See why we receive comments on our YouTube Videos like "This company is insanely advanced" and "Wow. This is mind blowing." See some of our recent Awards and Recognition and read about some of the reasons to live in Cincinnati.

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