About the role
What you'll do
Product Positioning & Messaging
Own the messaging and positioning for TYLsemi's chiplet portfolio — connectivity (TYL·IO), power delivery (TYL·Power), and custom silicon platform (TYL·Forge)
Develop audience-specific messaging for hyperscalers, AI chip startups, and custom silicon teams
Translate complex semiconductor architecture into clear, compelling value propositions that resonate with both technical and business audiences
Maintain and evolve the messaging framework as products and market conditions develop
Go-to-Market Strategy
Define and execute go-to-market plans for new product introductions and platform launches
Partner with the team to develop customer-facing materials — datasheets, solution briefs, pitch decks, and competitive battlecards
Build and maintain competitive intelligence on the chiplet and custom silicon landscape
Identify and prioritize market segments and customer personas for each product line
Content & Thought Leadership
Write and produce technical content — white papers, application notes, blog posts, and website copy — that establishes TYLsemi as a category leader
Develop executive presentation content for investor briefings, analyst meetings, and industry keynotes
Build and manage a content calendar aligned to product milestones, industry events, and media opportunities
Partner with PR and communications partners to amplify TYLsemi's presence across trade media, analyst firms, and social channels
Qualifications
Required
10+ years of product marketing experience in semiconductors, EDA/IP, or related deep tech — with demonstrated success marketing to technical buyers
Deep understanding of the AI silicon ecosystem — hyperscaler silicon teams, custom ASIC programs, and the chiplet/advanced packaging landscape
Strong technical foundation — comfortable discussing UCIe, PCIe, heterogeneous integration, and power delivery at an architecture level
Proven ability to create compelling messaging and content that resonates with both engineers and executives
Excellent written communication — you can write a crisp 300-word product brief and a 3,000-word white paper with equal skill
Located in or willing to relocate to the San Francisco Bay Area
Preferred
Prior experience at a chiplet, advanced packaging, or AI silicon company
Familiarity with UCIe/PCIe/Ethernet standards, CoWoS/advanced packaging, and multi-die integration architectures
Experience marketing to hyperscaler silicon teams, AI accelerator companies, or custom ASIC customers
Existing relationships with semiconductor trade press and analyst community
Experience building a product marketing function from scratch at an early-stage company
MBA or equivalent — not required, but valued
The total compensation range for this role is: 200,000.00 - 350,000.00 USD per year (San Jose (HQ))
| Location | San Jose, California |
| Salary | $200,000–$350,000 Per Year |
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