At Kulicke and Soffa, (NASDAQ:KLIC) our engineers make that decision daily. We are an international leading provider of robotic semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. We are seeking an engineer who with their related experience will provide solutions support of the development of Semiconductor Packaging and Assembly equipment. The candidate will be a member of a highly skilled and motivated engineering team and will be encouraged to take on the responsibility of a broad range of tasks. You will be responsible for transforming concepts into actual parts of the system, and testing the developed module, the system integration and verifying if requirements are met.
Knowledge & Experience requirements
At least 5 years of experience in R&D or Product Engineering, Semiconductor equipment experience is preferred.
Experience with mechanical and mathematical modeling tools (Visual Basic, MS Excel, MATLAB, Python, Mathcad)
Hands-on experience - test set-up, troubleshooting, design of experiments, lab equipment, etc. (for example using test equipment such as laser displacement, optical microscopes, shear and pull tester, SEM, ion mill, chemical etching)
Experience working with vendors and sub-contractors
Education Requirements
Masters or Bachelor's degree with at least 5 years of experience in Mechanical engineering, Mechatronics Engineering or equivalent. PhD in relevant areas are highly encouraged to apply.
Other requirements
Good written and verbal communication, interpretation and interpersonal skills
Flexible to changes in tasks and work environment
Must be organized, systematic, punctual, and goal-oriented
Strong leadership skill with ability to work with cross functional teams
Willing to travel on a need basis
Specific duties will include:
Detailed design, analysis, development and organization of electro-mechanical and / or software systems, consisting of specialized sub-systems and their integration into products and applications.
Design, analyze and testing of Ultrasonic Transducers and Sensors, including Bode, Vibrometer, FE modeling and simulations
Problem solve on a wide range of difficult problems within an engineering discipline in imaginative and practical ways, utilizes experimental methods such as design of experiments (DOE), analysis of variants, linear regression analysis, statistical process and control.
Analysis of situation or data requiring detailed evaluation of identifiable factors, exercises judgment within broadly defined practices and policies in selecting methods, techniques and evaluation criteria for obtaining results.
Assist in preparation of engineering plans and programs.
Independent operating of wire bonders and other test and measurement equipment. Receive minimal instruction on new assignments and provide technical guidance and leads or coordinates the activities of other engineers, designers and technicians.
Running tests on bench or on the wire bonder.
Collect and analyze data and write engineering report and presentations.
Tests could involve using oscilloscope and other instruments as needed.
Specific duties will include:
Detailed design, analysis, development and organization of electro-mechanical and / or software systems, consisting of specialized sub-systems and their integration into products and applications.
Design, analyze and testing of Ultrasonic Transducers and Sensors, including Bode, Vibrometer, FE modeling and simulations
Problem solve on a wide range of difficult problems within an engineering discipline in imaginative and practical ways, utilizes experimental methods such as design of experiments (DOE), analysis of variants, linear regression analysis, statistical process and control.
Analysis of situation or data requiring detailed evaluation of identifiable factors, exercises judgment within broadly defined practices and policies in selecting methods, techniques and evaluation criteria for obtaining results.
Assist in preparation of engineering plans and programs.
Independent operating of wire bonders and other test and measurement equipment. Receive minimal instruction on new assignments and provide technical guidance and leads or coordinates the activities of other engineers, designers and technicians.
Running tests on bench or on the wire bonder.
Collect and analyze data and write engineering report and presentations.
Tests could involve using oscilloscope and other instruments as needed.
Numbers & Facts
Location
Fort Washington, PA
Skills
Analysis Skillsunmatched
Assembly Equipmentunmatched
Cross-Functionalunmatched
Data Analysisunmatched
Data Collectionunmatched
Electromechanical Systemsunmatched
Electronics Assemblyunmatched
Experiment Designunmatched
Interpersonal Skillsunmatched
Laboratory Equipmentunmatched
Leadershipunmatched
MATLABunmatched
Mathematical Modelingunmatched
Mechanical Engineeringunmatched
Microsoft Excelunmatched
Microsoft Visual Basicunmatched
Organizational Skillsunmatched
Oscilloscopeunmatched
Policy Developmentunmatched
Presentation/Verbal Skillsunmatched
Problem Solving Skillsunmatched
Process Engineeringunmatched
Product Engineeringunmatched
Product Packagingunmatched
Python Programming/Scripting Languageunmatched
Reporting Skillsunmatched
Research & Development (R&D)unmatched
Search Engine Marketing (SEM)unmatched
Semiconductorsunmatched
Statistical Process Controlunmatched
Statisticsunmatched
System Integration (SI)unmatched
System Testunmatched
Team Playerunmatched
Technical Leadershipunmatched
Technical Presentationunmatched
Test & Measurement Equipmentunmatched
Test Benchunmatched
Test Equipmentunmatched
Test Plan/Scheduleunmatched
Testingunmatched
United States Department of Energy (DOE)unmatched
Willing to Travelunmatched
Writing Skillsunmatched
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