Senior Engineer I, AS Field Application

• Bachelors Degree preferred in Mechanical or Electrical Engineering, Physics or other fields related to semiconductor packaging;
• 2+ years of experience in a related field;
• Knowledge of the semiconductor packaging is a plus;
• Hands-on, strong aptitude and deep understanding of highly advanced machinery;
• Experience with Advanced Packaging (flip chip, die attach or thermocompression bonding) or semiconductor manufacturing highly preferred;
• Strong data analysis skills
• Candidates with higher qualifications may be considered for a more senior position
• Position to be located in Rio Rancho (New Mexico)

Kulicke & Soffa is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, sexual, gender identity or protected veteran status.

• Work closely with our customers to develop and optimize advanced packaging processes for semiconductor manufacturing
• Serve as the lead technical interface for customers, helping them develop and optimize their packaging recipes
• Troubleshoot and repair semiconductor packaging equipment, perform preventive maintenance (PM) on the machines when needed and train the customer engineers to use the equipment
• Communicate and align with the customer on a daily basis, prepare internal summary reports and customer presentations
• Escalate issues to the rest of the engineering team at other sites and work closely with them for resolutions
• Collaborate closely with the engineering team to support, maintain, and enhance machine performance, implementing feedback from field experiences
• Report identified issues and field observations to the engineering team, providing clear documentation to support continuous improvement efforts
• Test, troubleshoot and recommend improvements to advanced packaging assembly equipment
• Identifies, analyzes and resolves system design weaknesses
• Work closely with our customers to develop and optimize advanced packaging processes for semiconductor manufacturing
• Serve as the lead technical interface for customers, helping them develop and optimize their packaging recipes
• Troubleshoot and repair semiconductor packaging equipment, perform preventive maintenance (PM) on the machines when needed and train the customer engineers to use the equipment
• Communicate and align with the customer on a daily basis, prepare internal summary reports and customer presentations
• Escalate issues to the rest of the engineering team at other sites and work closely with them for resolutions
• Collaborate closely with the engineering team to support, maintain, and enhance machine performance, implementing feedback from field experiences
• Report identified issues and field observations to the engineering team, providing clear documentation to support continuous improvement efforts
• Test, troubleshoot and recommend improvements to advanced packaging assembly equipment
• Identifies, analyzes and resolves system design weaknesses