Senior Engineer, Semi Packaging Engineering

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

          

We are seeking a highly motivated Senior Engineer, Systems Semiconductor Packaging Engineer to join a multidisciplinary team developing advanced semiconductor modules and systems level solutions for Healthcare, Industrial, New Energy, Robotics and Physical AI applications.

This role will drive product realization from concept through manufacturing by working closely with cross-functional design teams, OSAT, ODM and EMS partners, material suppliers and global manufacturing vendors across multiple time zones. The ideal candidate should have 2 - 5 years of experience in semiconductor packaging, system integration, manufacturing process development and reliability engineering.

We will consider candidates with a PhD and less industry experience.

 

Potential candidate is expected to:

• Work closely with cross-functional teams to design and develop advanced systems level packaging solutions including heterogeneous packaging solutions, multi-chip modules, sensor packages and high-density interconnect assemblies.
• Lead assembly process developments to support Digital Health Care, Medical Devices, Industrial, Robotics and Physical AI applications. Adheres to strict documentation practices in a regulated environment and owns design control processes. Engineer new materials, processes and assembly capabilities to suit to end applications.
• Own manufacturing engineering activities including process characterization, collaborate with QA and Reliability teams to drive root cause analysis, yield improvements and Corrective/ preventive actions (CAPA) to meet manufacturability, scalability, and cost optimizations. 
• Drive PFMEA, DOE, SPC, GR&R and statical analysis activities to improve process capability, assembly robustness and long-term reliability.
• Work closely with OSATs, substrate vendors, PCB suppliers and assembly partners to define package architecture, DFM/DFX requirements and qualification strategies. Takes accountability in design and process development for high volume production. Benchmark industry best practices and evaluate emerging technologies for design and process innovation.
• Ability to collate information with appropriate supporting data and present into a coherent report for communication and distribution.
• Communicate complex technical concepts effectively to global engineering, operations, suppliers and executive teams.

 

Minimum Qualifications

• Master's degree in Engineering (Mechanical Engineering, Materials Science, Semiconductor Engineering, Applied Physics, or equivalent).
• Ph.D. in a relevant engineering or science discipline is preferred.
• Must have 2-5 years of industrial experience in advanced semiconductor packaging, electronics assembly, systems integration engineering, or manufacturing engineering.
• Candidates with a Ph.D. and limited industry experience are encouraged to apply, provided they demonstrate strong technical expertise relevant to semiconductor packaging, materials engineering, process development, or systems integration.
• Experience working with OSATs, substrate vendors, EMS partners, and semiconductor manufacturing ecosystems.
• Strong understanding of advanced semiconductor packaging technologies, heterogeneous integration, multi-chip modules, materials, and assembly processes.
• Familiarity with DOE, PFMEA, SPC, GR&R, 8D, RCA, design controls, and statistical analysis techniques.
• Educational background in materials science and mechanical behavior of materials with the ability to apply engineering fundamentals to practical product design.
• Experience with 3D CAD tools (SolidWorks or equivalent).
• Excellent analytical, problem-solving, project management, and communication skills.
• Experience in Medical Devices, Healthcare, Industrial Systems, Robotics, or regulated manufacturing environments is a strong advantage.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export  licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.  As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Experienced

          

Required Travel: Yes, 10% of the time

          

Shift Type: 1st Shift/Days

The expected wage range for a new hire into this position is $95,600 to $131,450.

• Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.

• This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.

• This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.