Senior Power Module Electrical Simulation Engineer

onsemi is seeking a self-driven and motivated professional to join our Corporate Central Engineering modeling and simulation team, located in Scottsdale, AZ or San Jose, CA. As a Senior Power Module Electrical Simulation Engineer, you will support the development of next-generation power modules and power delivery solutions for AI data center applications - driving new package and system integration, new product design, assembly and process development, quality and reliability, and worldwide customer engagements. As AI compute pushes power demands to unprecedented current densities, you will help shape the power module architectures that make high-efficiency, high-reliability data center power delivery possible.

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

• PhD degree (or Master''s degree with 3 years'' experience) in Electrical Engineering, electrical simulation, or Physics with e-simulation

• Experience and skills in electrical modeling and simulation at the power module, package, and system level

• Understanding of power semiconductor devices (SiC, GaN, silicon), switching dynamics, and power loss mechanisms

• Knowledge and experience of CAD concepts and SolidWorks

• Familiarity with semiconductor packaging, power module, and system integration

• Familiarity with material electrical properties

• Strong knowledge of problem analysis and diagnosis techniques

• Familiarity with package test and analysis, quality assurance, and reliability methods

• Ability to perform model correlation to empirical measurement

• Familiarity with the Unix/Linux operating system

• Familiarity with FEA software ANSYS HFSS, SIwave, Q3D, Maxwell, and ANSYS Electronics Desktop

• Strong English communication capability

• Strong learning capability

• Good team player

The successful candidate will have the opportunity to:

Perform power module, package, and system-level integration electrical simulation for AI data center power delivery applications

Model electrical-thermal-mechanical interaction for next-generation breakthrough power modules, including SiC and GaN wide-bandgap devices, ISG chiplet, ASG, and 3D integration

Extract and analyze parasitic RLC (resistance, loop inductance, capacitance) of module layouts, busbars, interconnects, and packaging to minimize switching loss, overshoot, and EMI

Perform high-frequency simulation including S-parameter and power integrity/PDN analysis under fast AI compute load transients

Conduct electro-thermal co-simulation to predict junction temperatures, current sharing, and hotspots against reliability and derating targets

Analyze and correlate modeling results to measured data from power module hardware

Develop and maintain state-of-the-art system integration, electrical, and electro-thermal modeling methodologies to improve modeling efficiency and accuracy

Set up and maintain the HW/SW environment for electrical-thermal-mechanical modeling

Provide power module electrical modeling support to field, application, and customer teams

Drive innovation of new power module technology through simulation

Develop advanced simulation methodologies such as AI/machine learning algorithms, AI agents, digital twins, and probabilistic and optimization methods

The successful candidate will have the opportunity to:

Perform power module, package, and system-level integration electrical simulation for AI data center power delivery applications

Model electrical-thermal-mechanical interaction for next-generation breakthrough power modules, including SiC and GaN wide-bandgap devices, ISG chiplet, ASG, and 3D integration

Extract and analyze parasitic RLC (resistance, loop inductance, capacitance) of module layouts, busbars, interconnects, and packaging to minimize switching loss, overshoot, and EMI

Perform high-frequency simulation including S-parameter and power integrity/PDN analysis under fast AI compute load transients

Conduct electro-thermal co-simulation to predict junction temperatures, current sharing, and hotspots against reliability and derating targets

Analyze and correlate modeling results to measured data from power module hardware

Develop and maintain state-of-the-art system integration, electrical, and electro-thermal modeling methodologies to improve modeling efficiency and accuracy

Set up and maintain the HW/SW environment for electrical-thermal-mechanical modeling

Provide power module electrical modeling support to field, application, and customer teams

Drive innovation of new power module technology through simulation

Develop advanced simulation methodologies such as AI/machine learning algorithms, AI agents, digital twins, and probabilistic and optimization methods